EP 2598439 A1 20130605 - RECYCLING OF SILICON SAWING SLURRIES USING THERMAL PLASMA FOR THE PRODUCTION OF INGOTS OR WAFERS
Title (en)
RECYCLING OF SILICON SAWING SLURRIES USING THERMAL PLASMA FOR THE PRODUCTION OF INGOTS OR WAFERS
Title (de)
RECYCLING VON SILICIUMSÄGESUSPENSIONEN MIT THERMISCHEM PLASMA ZUR HERSTELLUNG VON INGOTS ODER WAFERN
Title (fr)
RECYCLAGE DE BOUES DE SCIAGE DE SILICIUM POUR LA PREPARATION DE LINGOTS OU DE PLAQUES PAR PLASMA THERMIQUE
Publication
Application
Priority
- FR 1056299 A 20100730
- FR 2011051331 W 20110610
Abstract (en)
[origin: WO2012013876A1] A thermal, advantageously inductive, plasma is used to purify silicon from sawing slurries. For this purpose a thermal plasma is generated and a silicon-containing sawing slurry is subjected to the thermal plasma, so as to deposit silicon on a substrate.
IPC 8 full level
C01B 33/037 (2006.01); C23C 4/12 (2006.01); C23C 4/18 (2006.01)
CPC (source: EP US)
C01B 33/021 (2013.01 - EP US); C01B 33/037 (2013.01 - EP US); C23C 4/123 (2016.01 - EP US); C23C 4/18 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2012013876 A1 20120202; EP 2598439 A1 20130605; FR 2963337 A1 20120203; FR 2963337 B1 20130301; US 2013139550 A1 20130606
DOCDB simple family (application)
FR 2011051331 W 20110610; EP 11735480 A 20110610; FR 1056299 A 20100730; US 201313751497 A 20130128