Global Patent Index - EP 2602309 B1

EP 2602309 B1 20170503 - Method of cleaning an electronic device with an alkaline liquid composition comprising a phosphonic acid derivative chelating agent

Title (en)

Method of cleaning an electronic device with an alkaline liquid composition comprising a phosphonic acid derivative chelating agent

Title (de)

Verfahren zur Reinigung einer elektronischen Vorrichtung mit einer alkalischen Reinigungsflüssigkeitszusammensetzung enthaltend einen Komplexbildner auf Basis eines Phosphonsäurederivats

Title (fr)

Méthode de nettoyage d'un dispositif électronique avec une composition alcaline liquide comprenant un agent séquestrant à base d'acide phosphonique

Publication

EP 2602309 B1 20170503 (EN)

Application

EP 12195375 A 20121204

Priority

JP 2011267368 A 20111206

Abstract (en)

[origin: EP2602309A1] To provide a cleaning liquid composition that has excellent removability for metallic impurities and particulates, does not cause corrosion of Cu, and can clean a semiconductor substrate having copper wiring in a production process for an electronic device such as a semiconductor device. [Solution means] A cleaning liquid composition for cleaning a semiconductor substrate having copper wiring, the cleaning liquid composition containing one or more types of basic compound containing no metal, and one or more types of phosphonic acid-based chelating agent, and having a hydrogen ion concentration (pH) of 8 to 10.

IPC 8 full level

C11D 11/00 (2006.01); C11D 3/30 (2006.01); C11D 3/36 (2006.01); C11D 7/32 (2006.01); C11D 7/36 (2006.01); C23G 1/18 (2006.01); C23G 1/20 (2006.01); H01L 21/02 (2006.01)

CPC (source: EP KR US)

C11D 1/62 (2013.01 - KR); C11D 1/79 (2013.01 - KR); C11D 3/30 (2013.01 - EP US); C11D 3/361 (2013.01 - EP US); C11D 7/3209 (2013.01 - EP US); C11D 7/36 (2013.01 - EP US); C23G 1/18 (2013.01 - EP US); C23G 1/20 (2013.01 - EP US); H01L 21/02052 (2013.01 - EP US); H01L 21/02068 (2013.01 - EP US); H01L 21/302 (2013.01 - KR); C11D 2111/22 (2024.01 - EP US)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 2602309 A1 20130612; EP 2602309 B1 20170503; CN 103146509 A 20130612; JP 2013119579 A 20130617; JP 6066552 B2 20170125; KR 102041624 B1 20191106; KR 20130063474 A 20130614; MY 165726 A 20180420; SG 191504 A1 20130731; TW 201336985 A 20130916; TW I565797 B 20170111; US 2013143785 A1 20130606; US 9334470 B2 20160510

DOCDB simple family (application)

EP 12195375 A 20121204; CN 201210517904 A 20121205; JP 2011267368 A 20111206; KR 20120140462 A 20121205; MY PI2012005069 A 20121123; SG 2012089926 A 20121206; TW 101145895 A 20121206; US 201213705575 A 20121205