EP 2606509 A4 20150916 - SEMICONDUCTOR CHIP ASSEMBLY AND METHOD OF PREPARING THE SAME
Title (en)
SEMICONDUCTOR CHIP ASSEMBLY AND METHOD OF PREPARING THE SAME
Title (de)
HALBLEITERCHIPANORDNUNG UND VERFAHREN ZU IHRER HERSTELLUNG
Title (fr)
ENSEMBLE PUCE À SEMI-CONDUCTEURS ET SON PROCÉDÉ DE PRÉPARATION
Publication
Application
Priority
- CN 201010261581 A 20100821
- CN 2011078491 W 20110816
Abstract (en)
[origin: WO2012025024A1] A semiconductor chip assembly and a method for forming the same are provided. The semiconductor chip assembly comprises: a semiconductor chip (20), a substrate (10), a first layer (203) formed on a surface of the substrate (10), in which one of the first layer (203) and the second layer (204) has an opening (205) therein; and a second layer (204) formed on a surface of the semiconductor chip (20) and connected to the first layer (203) by eutectic bonding.
IPC 8 full level
H01L 21/58 (2006.01); H01L 33/40 (2010.01)
CPC (source: EP)
H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 33/0093 (2020.05); H01L 33/40 (2013.01); H01L 24/05 (2013.01); H01L 33/641 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05138 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/27472 (2013.01); H01L 2224/27622 (2013.01); H01L 2224/27831 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/2908 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29113 (2013.01); H01L 2224/29116 (2013.01); H01L 2224/29138 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83345 (2013.01); H01L 2224/83805 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12041 (2013.01)
Citation (search report)
- [X] EP 0313174 A2 19890426 - SUMITOMO ELECTRIC INDUSTRIES [JP]
- [X] JP 2006128254 A 20060518 - HITACHI MEDIA ELECTRON KK
- [XI] GB 1581436 A 19801217 - EMI LTD
- See references of WO 2012025024A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2012025024 A1 20120301; CN 102024717 A 20110420; CN 102024717 B 20120307; EP 2606509 A1 20130626; EP 2606509 A4 20150916
DOCDB simple family (application)
CN 2011078491 W 20110816; CN 201010261581 A 20100821; EP 11819399 A 20110816