EP 2615396 A1 20130717 - Assembly and method for pre-heating circuit boards for thermoforming
Title (en)
Assembly and method for pre-heating circuit boards for thermoforming
Title (de)
Anlage und Verfahren zum Vorwärmen von Platinen beim Warmumformen
Title (fr)
Installation et procédé de préchauffage de platines lors de déformations à chaud
Publication
Application
Priority
- DE 102011120681 A 20111208
- EP 12002748 A 20120419
- EP 12008168 A 20121206
Abstract (en)
The invention relates to a plant (10) for hot forming blanks (P), comprising at least one preheating device (2) and at least one main heating device (4), which is arranged downstream from the at least one preheating device (2). The preheating device (2) encompasses at least one, in particular pre-mixing, burner, which is embodied as hydrogen-oxygen burner, fuel gas-oxygen burner or acetylene burner.
IPC 8 full level
F27B 9/02 (2006.01); B21J 1/06 (2006.01); C21D 9/00 (2006.01); C21D 9/46 (2006.01); C21D 9/48 (2006.01); F27B 9/14 (2006.01); F27B 9/24 (2006.01); F27B 9/36 (2006.01)
CPC (source: EP)
C21D 1/34 (2013.01); C21D 1/52 (2013.01); C21D 1/673 (2013.01); C21D 9/005 (2013.01); C21D 9/0068 (2013.01); F27B 9/02 (2013.01); F27B 9/028 (2013.01); F27B 9/142 (2013.01); F27B 9/243 (2013.01); C21D 9/46 (2013.01)
Citation (applicant)
DE 10354411 A1 20050623 - LINDE AG [DE]
Citation (search report)
- [XI] US 2010086002 A1 20100408 - HWANG JUNG BOK [KR], et al
- [A] DE 102009019496 A1 20101118 - BRAUN ELISABETH [DE]
- [A] JP H11325421 A 19991126 - MITSUBISHI HEAVY IND LTD
- [XI] WO 2011126427 A1 20111013 - LINDE AG [DE], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DOCDB simple family (application)
EP 12008168 A 20121206