EP 2617070 A1 20130724 - OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING IT
Title (en)
OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING IT
Title (de)
OPTOELEKTRONISCHES BAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG
Title (fr)
COMPOSANT OPTOÉLECTRONIQUE ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
- DE 102010045403 A 20100915
- EP 2011064377 W 20110822
Abstract (en)
[origin: WO2012034826A1] An optoelectronic component is specified, comprising a carrier (3), which has a first (1) and a second connection region (2), and comprising a radiation-emitting semiconductor chip (4), which has a base surface (5) and a radiation exit surface (6), opposite the base surface, wherein the semiconductor chip (4) is arranged by the base surface (5) on the carrier (3). Furthermore, the optoelectronic component comprises a housing (10) having a lower housing part (8), which adjoins side flanks (14) of the semiconductor chip (4), and an upper housing part (9), which forms a reflector (15) for the radiation (16) emitted by the semiconductor chip (4). An electrical connection layer (7) is led from the radiation exit surface (6) of the semiconductor chip (4) via a part of the interface (19) between the lower (8) and the upper housing part (9) and through the lower housing part (8) to the first connection region (1) on the carrier (3). An advantageous method for producing the optoelectronic component is furthermore specified.
IPC 8 full level
H01L 33/38 (2010.01); H01L 23/055 (2006.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01)
CPC (source: EP KR US)
H01L 24/18 (2013.01 - US); H01L 24/24 (2013.01 - EP US); H01L 24/82 (2013.01 - EP US); H01L 33/38 (2013.01 - KR); H01L 33/48 (2013.01 - KR); H01L 33/54 (2013.01 - KR); H01L 33/60 (2013.01 - EP US); H01L 33/62 (2013.01 - EP KR US); H01L 23/055 (2013.01 - EP US); H01L 33/505 (2013.01 - EP US); H01L 33/54 (2013.01 - EP US); H01L 2224/24 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/73267 (2013.01 - EP US); H01L 2224/92244 (2013.01 - EP US)
Citation (search report)
See references of WO 2012034826A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102010045403 A1 20120315; CN 103109383 A 20130515; EP 2617070 A1 20130724; KR 20130054430 A 20130524; US 2013307004 A1 20131121; US 8901592 B2 20141202; WO 2012034826 A1 20120322
DOCDB simple family (application)
DE 102010045403 A 20100915; CN 201180044291 A 20110822; EP 11755034 A 20110822; EP 2011064377 W 20110822; KR 20137009233 A 20110822; US 201113822367 A 20110822