Global Patent Index - EP 2619792 A1

EP 2619792 A1 20130731 - MULTIFUNCTION SENSOR AS POP MICROWAVE PCB

Title (en)

MULTIFUNCTION SENSOR AS POP MICROWAVE PCB

Title (de)

MULTIFUNKTIONSSENSOR ALS POP-MWLP

Title (fr)

CAPTEUR MULTIFONCTION EN TANT QUE POP-MWLP

Publication

EP 2619792 A1 20130731 (DE)

Application

EP 11739047 A 20110729

Priority

  • DE 102010041129 A 20100921
  • EP 2011063070 W 20110729

Abstract (en)

[origin: WO2012038127A1] The invention relates to a method for producing a component which comprises at least one micro-structured or nano-structured element (1). In the context of the method according to the invention, at least one micro-structured or nano-structured element (1) having at least one area (2) provided for making contact is applied to a carrier (3), wherein the element (1) is applied to the carrier (3) such that at least one area (2) of the element (1) that is provided for making contact adjoins the carrier (3). Subsequently, the element (1) is enveloped in an enveloping compound (4) and the element-enveloping compound composite (5) is detached from the carrier (3). Then, a first layer (6) comprising electrically conductive areas is applied to the side of the element-enveloping compound composite (5) that previously adjoined the carrier (3). Before, after or at the same time, at least one passage (7) is introduced into the enveloping compound (4). Subsequently, a conductor layer is applied to the surface of the passage (7) and at least to a section of the layer (6) comprising the first electrically conductive areas, such that the conductor layer (8) electrically contacts an area (2) provided for contacting, in order to generate a through contact (7), which enables space-saving contacting. The invention further relates to such a component.

IPC 8 full level

H01L 21/98 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 25/16 (2006.01)

CPC (source: EP US)

B81B 7/0006 (2013.01 - US); B81B 7/0074 (2013.01 - US); B81C 1/00333 (2013.01 - US); H01L 21/561 (2013.01 - EP US); H01L 21/568 (2013.01 - EP US); H01L 23/3121 (2013.01 - EP US); H01L 24/19 (2013.01 - EP US); H01L 24/20 (2013.01 - EP US); H01L 24/24 (2013.01 - EP US); H01L 24/82 (2013.01 - EP US); H01L 24/96 (2013.01 - EP US); H01L 25/0652 (2013.01 - EP US); H01L 25/0655 (2013.01 - EP US); H01L 25/0657 (2013.01 - EP US); H01L 25/105 (2013.01 - EP US); H01L 25/16 (2013.01 - EP US); H01L 25/50 (2013.01 - EP US); H01L 24/04 (2013.01 - EP US); H01L 24/06 (2013.01 - EP US); H01L 24/12 (2013.01 - EP US); H01L 24/32 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/73 (2013.01 - EP US); H01L 24/97 (2013.01 - EP US); H01L 2224/0401 (2013.01 - EP US); H01L 2224/04105 (2013.01 - EP US); H01L 2224/06181 (2013.01 - EP US); H01L 2224/12105 (2013.01 - EP US); H01L 2224/24137 (2013.01 - EP US); H01L 2224/32145 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48137 (2013.01 - EP US); H01L 2224/48225 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2224/73267 (2013.01 - EP); H01L 2224/97 (2013.01 - EP US); H01L 2225/0651 (2013.01 - EP US); H01L 2225/06517 (2013.01 - EP US); H01L 2225/06524 (2013.01 - EP US); H01L 2225/06541 (2013.01 - EP US); H01L 2225/06551 (2013.01 - EP US); H01L 2225/06582 (2013.01 - EP US); H01L 2225/1035 (2013.01 - EP US); H01L 2225/1058 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01019 (2013.01 - EP US); H01L 2924/01024 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H01L 2924/18162 (2013.01 - EP US)

Citation (search report)

See references of WO 2012038127A1

Citation (examination)

WO 0249103 A2 20020620 - INTEL CORP [US], et al

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

DE 102010041129 A1 20120322; CN 103098201 A 20130508; CN 103098201 B 20151014; EP 2619792 A1 20130731; JP 2013537368 A 20130930; JP 5714112 B2 20150507; US 2013256919 A1 20131003; US 8987921 B2 20150324; WO 2012038127 A1 20120329

DOCDB simple family (application)

DE 102010041129 A 20100921; CN 201180045209 A 20110729; EP 11739047 A 20110729; EP 2011063070 W 20110729; JP 2013528571 A 20110729; US 201113825436 A 20110729