EP 2620441 B1 20181031 - MODIFIED PRODUCT OF POLYHEDRAL STRUCTURE POLYSILOXANE, POLYHEDRAL STRUCTURE POLYSILOXANE COMPOSITION, CURED PRODUCT, AND OPTICAL SEMICONDUCTOR DEVICE
Title (en)
MODIFIED PRODUCT OF POLYHEDRAL STRUCTURE POLYSILOXANE, POLYHEDRAL STRUCTURE POLYSILOXANE COMPOSITION, CURED PRODUCT, AND OPTICAL SEMICONDUCTOR DEVICE
Title (de)
MODIFIZIERTES PRODUKT AUS POLYSILOXAN MIT EINER POLYEDERSTRUKTUR, POLYSILOXANZUSAMMENSETZUNG MIT EINER POLYEDERSTRUKTUR, GEHÄRTETES PRODUKT UND OPTISCHE HALBLEITERVORRICHTUNG
Title (fr)
POLYSILOXANE MODIFIÉ À STRUCTURE POLYÉDRIQUE, COMPOSITION À BASE DE POLYSILOXANE À STRUCTURE POLYÉDRIQUE, PRODUIT DURCI, ET DISPOSITIF SEMI-CONDUCTEUR OPTIQUE
Publication
Application
Priority
- JP 2011064641 A 20110323
- JP 2010211887 A 20100922
- JP 2011070854 W 20110913
Abstract (en)
[origin: EP2620441A1] An object of the present invention is to provide a polyhedral polysiloxane composition that has high heat resistance and high light resistance, is excellent in gas-barrier properties and thermal shock resistance, and exhibits good handleability when used to encapsulate an optical semiconductor device. The polyhedral polysiloxane composition of the present invention is characterized by including a modified polyhedral polysiloxane which is obtained by hydrosilylation of an alkenyl group-containing polyhedral polysiloxane compound (a) and a hydrosilyl group-containing compound (b) and has a structure derived from an organic silicon compound (a') having one alkenyl group per molecule.
IPC 8 full level
C07F 7/21 (2006.01); C08G 77/00 (2006.01); C08G 77/50 (2006.01); C08K 5/34 (2006.01); C08K 5/3492 (2006.01); C08K 5/56 (2006.01); C08L 83/00 (2006.01); C08L 83/04 (2006.01); H01L 33/56 (2010.01); C08G 77/04 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01)
CPC (source: EP KR US)
C07F 7/21 (2013.01 - EP KR US); C08G 77/44 (2013.01 - KR); C08G 77/50 (2013.01 - EP US); C08G 77/80 (2013.01 - EP US); C08K 5/34924 (2013.01 - EP US); C08K 5/56 (2013.01 - EP US); C08L 83/00 (2013.01 - EP US); C08L 83/04 (2013.01 - EP US); C08L 83/14 (2013.01 - KR); H01L 33/56 (2013.01 - US); C08G 77/045 (2013.01 - EP US); C08G 77/12 (2013.01 - EP US); C08G 77/20 (2013.01 - EP US); C08K 2201/008 (2013.01 - EP US)
C-Set (source: EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2620441 A1 20130731; EP 2620441 A4 20141015; EP 2620441 B1 20181031; CN 103119048 A 20130522; CN 103119048 B 20160601; JP 5784618 B2 20150924; JP WO2012039322 A1 20140203; KR 101886173 B1 20180808; KR 20130097197 A 20130902; TW 201221556 A 20120601; TW 201612217 A 20160401; TW I526477 B 20160321; TW I567114 B 20170121; US 2013237663 A1 20130912; US 9698320 B2 20170704; WO 2012039322 A1 20120329
DOCDB simple family (application)
EP 11826768 A 20110913; CN 201180045637 A 20110913; JP 2011070854 W 20110913; JP 2012535004 A 20110913; KR 20137007798 A 20110913; TW 100134011 A 20110921; TW 104144344 A 20110921; US 201113823497 A 20110913