EP 2620529 B1 20140430 - Method for producing matt copper deposits
Title (en)
Method for producing matt copper deposits
Title (de)
Verfahren zur Herstellung von matten Kupferablagerungen
Title (fr)
Procédé de production de dépôts de cuivre mate
Publication
Application
Priority
EP 12152390 A 20120125
Abstract (en)
[origin: EP2620529A1] The present invention relates to a method for deposition of a matt copper coating wherein a first copper layer is deposited from an aqueous copper electrolyte which does not contain an organic compound comprising divalent sulfur. A second copper layer is then deposited onto the first copper layer from an aqueous copper electrolyte comprising a first and a second water soluble sulfur-containing additive wherein the first water soluble sulfur-containing compound is an alkyl sulfonic acid derivative and the second water soluble sulfur-containing additive is an aromatic sulfonic acid derivative. The method provides copper layers with a homogeneous and adjustable matt appearance for decorative applications.
IPC 8 full level
CPC (source: EP KR US)
C25D 3/38 (2013.01 - EP KR US); C25D 5/10 (2013.01 - EP KR US); C25D 5/627 (2020.08 - EP KR US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2620529 A1 20130731; EP 2620529 B1 20140430; BR 112014018114 A2 20170620; BR 112014018114 A8 20170711; BR 112014018114 B1 20200901; CA 2862141 A1 20130801; CA 2862141 C 20200310; CN 104080955 A 20141001; CN 104080955 B 20160323; ES 2478267 T3 20140721; JP 2015510038 A 20150402; JP 6086930 B2 20170301; KR 101979975 B1 20190903; KR 20140119123 A 20141008; PL 2620529 T3 20140930; TW 201333274 A 20130816; TW I526582 B 20160321; US 2015014177 A1 20150115; WO 2013110373 A2 20130801; WO 2013110373 A3 20140424
DOCDB simple family (application)
EP 12152390 A 20120125; BR 112014018114 A 20121127; CA 2862141 A 20121127; CN 201280068192 A 20121127; EP 2012073688 W 20121127; ES 12152390 T 20120125; JP 2014553641 A 20121127; KR 20147022888 A 20121127; PL 12152390 T 20120125; TW 101147026 A 20121212; US 201214374000 A 20121127