Global Patent Index - EP 2621027 B1

EP 2621027 B1 20140312 - ASSEMBLY AND ELEMENT FOR HIGH FREQUENCY CONNEXION AND METHOD FOR MAKING SAID ELEMENT

Title (en)

ASSEMBLY AND ELEMENT FOR HIGH FREQUENCY CONNEXION AND METHOD FOR MAKING SAID ELEMENT

Title (de)

ANORDNUNG UND ELEMENT ZUR HOCHFREQUENZVERBINDUNG UND VERFAHREN ZUR HERSTELLUNG EINES SOLCHEN ELEMENTS

Title (fr)

Ensemble et élément de connexion hyperfréquence et procédé de fabrication d'un tel élément

Publication

EP 2621027 B1 20140312 (FR)

Application

EP 13152728 A 20130125

Priority

FR 1250766 A 20120126

Abstract (en)

[origin: EP2621027A1] The element (10) has a body (2) including an inner passage (21) surrounding a central axis (X), a monolithic conductive contact rod extending along the axis, and an insulating ring (4) surrounding the axis. The body includes holes (22a, 22b) that connect an outer surface of the connection element to the inner passage. The ring includes an outer peripheral slot (43) communicating with the holes, where a resin securing the ring with the body is housed in the hole and in the slot of the ring, and the ring is removable before the resin is housed in the holes and in the slot of the ring. An independent claim is also included for a method for manufacturing the hyperfrequency connection element.

IPC 8 full level

H01R 13/405 (2006.01); H01R 13/516 (2006.01); H01R 24/44 (2011.01); H01R 43/20 (2006.01); H01R 43/24 (2006.01); H01R 103/00 (2006.01)

CPC (source: EP US)

H01R 13/405 (2013.01 - EP US); H01R 13/516 (2013.01 - US); H01R 24/44 (2013.01 - EP US); H01R 43/20 (2013.01 - US); H01R 43/24 (2013.01 - EP US); H01R 2103/00 (2013.01 - EP US); Y10T 29/4921 (2015.01 - EP US)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 2621027 A1 20130731; EP 2621027 B1 20140312; CN 103227387 A 20130731; CN 103227387 B 20170301; FR 2986378 A1 20130802; FR 2986378 B1 20141128; US 2013196536 A1 20130801; US 8814592 B2 20140826

DOCDB simple family (application)

EP 13152728 A 20130125; CN 201310032882 A 20130128; FR 1250766 A 20120126; US 201313747830 A 20130123