EP 2622259 B1 20150902 - LIGHTING MODULE ASSEMBLY COMPRISING AN LED ON A CIRCUIT BOARD
Title (en)
LIGHTING MODULE ASSEMBLY COMPRISING AN LED ON A CIRCUIT BOARD
Title (de)
LEUCHTMODULANORDNUNG MIT EINER LED AUF EINER PLATINE
Title (fr)
SYSTEME D'ECLAIRAGE MODULAIRE COMPRENANT UNE DEL SUR UNE PLATINE
Publication
Application
Priority
- DE 102010041471 A 20100927
- EP 2011066635 W 20110926
Abstract (en)
[origin: WO2012041795A1] The invention relates to a lighting module assembly for a luminaire. The lighting module assembly comprises at least one LED (2), at least one circuit board (4), wherein the at least one LED (2) is arranged on the at least one circuit board (4), and a carrier element (6), on which the at least one circuit board (6) is mounted. In addition, the lighting module assembly comprises at least one pressing element (8), which is arranged such that it presses the at least one circuit board (4) against a surface region of the carrier element. Because of the design comprising such a pressing element (8), no glued connection is required between the circuit board (4) and the carrier element (6). Improved thermal transfer is thus made possible between the circuit board (4) and the carrier element (6). Moreover, because of the pressing element (8) it can be achieved that the pressing force acting on the circuit board (4) is uniformly maintained over the course of the service life of the lighting module assembly such that a decrease of the quality of the thermal contact can virtually be excluded or can at least be significantly reduced as compared to the prior art.
IPC 8 full level
F21S 4/00 (2006.01); F21V 17/16 (2006.01); F21V 19/00 (2006.01); F21V 29/00 (2015.01); F21Y 101/02 (2006.01); F21Y 103/00 (2006.01)
CPC (source: EP US)
F21S 4/00 (2013.01 - EP US); F21V 19/004 (2013.01 - EP US); F21V 29/70 (2015.01 - US); F21V 17/164 (2013.01 - EP); F21Y 2103/10 (2016.07 - EP US); F21Y 2115/10 (2016.07 - EP US)
Citation (opposition)
Opponent : ITZ Innovations- und Technologiezentrum GmbH
- WO 2010004503 A1 20100114 - KONINKL PHILIPS ELECTRONICS NV [NL], et al
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- US 2007098334 A1 20070503 - CHEN KUEI-FANG [TW]
- US 2009303712 A1 20091210 - WUNG SHIH-HSUN [TW], et al
- US 2010008066 A1 20100114 - MORO SHUUJI [JP], et al
- US 7712926 B2 20100511 - MATHESON GEORGE E [CA]
- EP 2147244 B1 20151202 - KONINKL PHILIPS NV [NL]
- DE 102008052869 A1 20100325 - SITECO BELEUCHTUNGSTECH GMBH [DE]
- DE 202008001026 U1 20080327 - BJB GMBH & CO KG [DE]
- WO 2010043662 A1 20100422 - OSRAM GMBH [DE], et al
- US 2010110671 A1 20100506 - GORDIN MYRON [US], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102010041471 A1 20120329; DE 102010041471 B4 20210211; CN 103119353 A 20130522; CN 103119353 B 20160810; EP 2622259 A1 20130807; EP 2622259 B1 20150902; EP 2622259 B2 20200415; WO 2012041795 A1 20120405
DOCDB simple family (application)
DE 102010041471 A 20100927; CN 201180046275 A 20110926; EP 11764521 A 20110926; EP 2011066635 W 20110926