Global Patent Index - EP 2623643 A4

EP 2623643 A4 20150304 - ALUMINUM ELECTROPLATING SOLUTION

Title (en)

ALUMINUM ELECTROPLATING SOLUTION

Title (de)

ALUMINUMGALVANISIERUNGSLÖSUNG

Title (fr)

SOLUTION DE DÉPÔT ÉLECTROLYTIQUE D'ALUMINIUM

Publication

EP 2623643 A4 20150304 (EN)

Application

EP 11828690 A 20110901

Priority

  • JP 2010220239 A 20100930
  • JP 2011069895 W 20110901

Abstract (en)

[origin: US2013168258A1] The purpose of the present invention is to provide an aluminum electroplating solution that allows aluminum electroplating to be conducted efficiently and in a short period of time, can increase the amount of electricity in the current of electroplating, and has high solubility in a nonaqueous solvent. This aluminum electroplating solution is characterized by comprising an aluminum metal salt, an ionic liquid obtained by an organic compound forming an ion pair with the aluminum metal salt, and an organic solvent having a dielectric constant of 8 or less. It is preferable for the volume percentage of the organic solvent in relation to the total volume of the ionic liquid and the organic solvent to be at least 30%, and for at least one of the following to be included as the organic solvent having a dielectric constant of 8 or less: hexane, toluene, diethyl ether, ethylacetate, cyclohexane, xylene, benzene, naphthalene, heptane, cyclopentyl methyl ether, and dioxane.

IPC 8 full level

C25D 3/44 (2006.01); C25D 3/66 (2006.01)

CPC (source: EP US)

C25D 3/44 (2013.01 - EP US); C25D 3/665 (2013.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

US 2013168258 A1 20130704; EP 2623643 A1 20130807; EP 2623643 A4 20150304; JP WO2012043129 A1 20140206; WO 2012043129 A1 20120405

DOCDB simple family (application)

US 201113820701 A 20110901; EP 11828690 A 20110901; JP 2011069895 W 20110901; JP 2012536292 A 20110901