EP 2627798 A1 20130821 - PROCESS FOR ELECTROLESS DEPOSITION OF METALS USING HIGHLY ALKALINE PLATING BATH
Title (en)
PROCESS FOR ELECTROLESS DEPOSITION OF METALS USING HIGHLY ALKALINE PLATING BATH
Title (de)
VERFAHREN ZUR STROMLOSEN ABSCHEIDUNG VON METALLEN MITHILFE EINES STARK ALKALISCHEN PLATTIERUNGSBADES
Title (fr)
PROCÉDÉ POUR LE DÉPÔT AUTOCATALYTIQUE DE MÉTAUX UTILISANT UN BAIN DE PLACAGE HAUTEMENT ALCALIN
Publication
Application
Priority
- US 201161457590 P 20110426
- US 201161457446 P 20110330
- US 34480010 P 20101013
- CA 2011001146 W 20111012
Abstract (en)
[origin: WO2012048412A1] A plating process using an electroless plating bath formed from two separate prepared component solutions. The component solutions mixed within 120 hours prior to plating operations, to provide a highly alkaline plating bath solution. One component solution of the two-part plating bath, is provided with a metal salt or source of plating ions, and which is initially kept in a separate solution from the second other prepared component solution. The second component solution contains formaldehyde, and preferably paraformaldehyde, used to reduce the metal salts into the metal to be deposited on a substrate. Each component solution further includes sodium hydroxide in concentrations selected so that when the two solutions are preferably mixed the final plating bath solution has a pH greater than 11.5.
IPC 8 full level
C23C 18/38 (2006.01); C23C 18/24 (2006.01); C23C 18/32 (2006.01)
CPC (source: EP KR US)
C23C 18/1637 (2013.01 - EP US); C23C 18/1639 (2013.01 - EP US); C23C 18/1658 (2013.01 - EP US); C23C 18/166 (2013.01 - EP US); C23C 18/1806 (2013.01 - EP US); C23C 18/1827 (2013.01 - EP US); C23C 18/1855 (2013.01 - EP US); C23C 18/1872 (2013.01 - EP US); C23C 18/24 (2013.01 - KR); C23C 18/31 (2013.01 - EP US); C23C 18/32 (2013.01 - EP KR US); C23C 18/38 (2013.01 - EP KR US); C23C 18/54 (2013.01 - US)
Citation (search report)
See references of WO 2012048412A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2012048412 A1 20120419; BR 112013008950 A2 20190924; CA 2813818 A1 20120419; CN 103221579 A 20130724; CN 103221579 B 20150429; EP 2627798 A1 20130821; JP 2013540205 A 20131031; JP 5937086 B2 20160622; KR 20140020829 A 20140219; MX 2013003935 A 20131017; MX 339242 B 20160518; US 2013209698 A1 20130815
DOCDB simple family (application)
CA 2011001146 W 20111012; BR 112013008950 A 20111012; CA 2813818 A 20111012; CN 201180049557 A 20111012; EP 11831881 A 20111012; JP 2013533061 A 20111012; KR 20137012294 A 20111012; MX 2013003935 A 20111012; US 201113878916 A 20111012