EP 2628178 A2 20130821 - THICK-WIRE BOND ARRANGEMENT AND METHOD FOR PRODUCING
Title (en)
THICK-WIRE BOND ARRANGEMENT AND METHOD FOR PRODUCING
Title (de)
DICKDRAHT-BONDANORDNUNG UND VERFAHREN ZUM HERSTELLEN
Title (fr)
SYSTÈME DE CÂBLAGE À FIL ÉPAIS ET PROCÉDÉ DE FABRICATION
Publication
Application
Priority
- DE 102010038130 A 20101012
- DE 2011075214 W 20110907
Abstract (en)
[origin: WO2012062300A2] The invention relates to a thick-wire bond arrangement, having a substrate (2), a thick wire (1) and a high-voltage thick-wire bond connection, where an end bond section (4) of the thick wire (1), which extends towards the end (7) of the thick wire (1), is bonded to the substrate (2), such that a bond contact (5) between the thick wire (1) and the substrate (2) is formed in the region of the bond section (4), the thick wire (1) having a tapering section (6) which adjoins the end (7) of the wire and in which the cross-section of the wire tapers towards the end (7) of the wire. The application further relates to a method for producing a thick-wire bond arrangement.
IPC 8 full level
H01L 23/49 (2006.01)
CPC (source: EP US)
H01L 24/43 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/85 (2013.01 - EP US); H05K 1/0271 (2013.01 - US); H05K 3/32 (2013.01 - US); H01L 24/45 (2013.01 - EP US); H01L 2224/43847 (2013.01 - EP US); H01L 2224/45015 (2013.01 - EP US); H01L 2224/45124 (2013.01 - EP US); H01L 2224/45144 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/48455 (2013.01 - EP US); H01L 2224/48456 (2013.01 - EP US); H01L 2224/4847 (2013.01 - EP US); H01L 2224/48699 (2013.01 - EP US); H01L 2224/85939 (2013.01 - EP US); H01L 2224/85947 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01014 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/10253 (2013.01 - EP US); H01L 2924/12041 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/2076 (2013.01 - EP US); Y10T 29/4913 (2015.01 - EP US)
Citation (search report)
See references of WO 2012062300A2
Citation (examination)
JP H07302811 A 19951114 - HITACHI LTD
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102010038130 A1 20120412; DE 102010038130 B4 20120419; EP 2628178 A2 20130821; US 2013220673 A1 20130829; US 9992861 B2 20180605; WO 2012062300 A2 20120518; WO 2012062300 A3 20120712
DOCDB simple family (application)
DE 102010038130 A 20101012; DE 2011075214 W 20110907; EP 11810567 A 20110907; US 201113878787 A 20110907