EP 2630653 A1 20130828 - APPARATUS FOR COATING A WAFER
Title (en)
APPARATUS FOR COATING A WAFER
Title (de)
VORRICHTUNG ZUM BESCHICHTEN EINES WAFERS
Title (fr)
DISPOSITIF DE REVÊTEMENT D'UNE TRANCHE
Publication
Application
Priority
EP 2010006372 W 20101019
Abstract (en)
[origin: WO2012052039A1] The invention relates to an apparatus for coating a surface (2o) of a wafer (2), - comprising a receptacle device (16) for receiving the wafer (2) on a receptacle surface (19) and - a nozzle device (10) for coating the wafer (2) in a Z-direction, characterized in that on a lateral circumference (2a) of the wafer (2) it is possible to arrange a ring (4) surrounding the wafer (2) with an inner circumference (4i) and serving for extending a coating area when coating the wafer (2).
IPC 8 full level
H01L 21/67 (2006.01)
CPC (source: EP KR US)
H01L 21/02041 (2013.01 - KR); H01L 21/0274 (2013.01 - KR); H01L 21/6715 (2013.01 - EP KR US)
Citation (search report)
See references of WO 2012052039A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2012052039 A1 20120426; CN 103155097 A 20130612; CN 103155097 B 20160323; EP 2630653 A1 20130828; EP 2630653 B1 20150401; JP 2013543267 A 20131128; JP 5661937 B2 20150128; KR 101497848 B1 20150304; KR 20130071474 A 20130628; SG 188953 A1 20130531; TW 201235112 A 20120901; TW I495516 B 20150811; US 2013160706 A1 20130627
DOCDB simple family (application)
EP 2010006372 W 20101019; CN 201080069727 A 20101019; EP 10770723 A 20101019; JP 2013534169 A 20101019; KR 20137006971 A 20101019; SG 2013015789 A 20101019; TW 100137971 A 20111019; US 201013820331 A 20101019