EP 2636001 A2 20130911 - SIM CARD AND MANUFACTURING METHOD
Title (en)
SIM CARD AND MANUFACTURING METHOD
Title (de)
SIM-KARTE UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
CARTE SIM ET PROCÉDÉ DE FABRICATION
Publication
Application
Priority
- MY PI2010005182 A 20101102
- IB 2011002825 W 20111004
Abstract (en)
[origin: WO2012059813A2] The present invention provides a method for manufacturing a SIM card without using a carrier card. An array of conductive modules is formed onto a first surface of a substrate. These conductive modules are spaced apart from each other with spacing configured to provide peripheral portions surrounding each conductive module. The peripheral portions are sized to provide sufficient substrate parts to form the SIM card body based on the industry standard. The substrate is then trimmed to form SIM card bodies and an IC chip is bonded to a second side of the substrate. The IC chip is then encapsulated and thereafter, a molding process is carried out to supply and form a molding part to cover the encapsulated IC chip and also flatten the bottom side of the substrate. The molding part together with the substrate forms a SIM card with the thickness conforming to the industry standard.
IPC 8 full level
G06K 19/077 (2006.01)
CPC (source: EP)
G06K 19/07743 (2013.01); G06K 19/07747 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48228 (2013.01)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2012059813 A2 20120510; WO 2012059813 A3 20120719; WO 2012059813 A9 20121115; EP 2636001 A2 20130911; EP 2636001 A4 20140903; TW 201229916 A 20120716
DOCDB simple family (application)
IB 2011002825 W 20111004; EP 11837644 A 20111004; TW 100137370 A 20111014