Global Patent Index - EP 2636061 A1

EP 2636061 A1 20130911 - LAMINATE COMPRISING AN INTEGRATED ELECTRONIC COMPONENT

Title (en)

LAMINATE COMPRISING AN INTEGRATED ELECTRONIC COMPONENT

Title (de)

LAMINAT MIT INTEGRIERTEM ELEKTRONISCHEN BAUTEIL

Title (fr)

LAMINÉ DOTÉ D'UN COMPOSANT ÉLECTRONIQUE INTÉGRÉ

Publication

EP 2636061 A1 20130911 (DE)

Application

EP 11785581 A 20111024

Priority

  • DE 102010050342 A 20101105
  • EP 2011005340 W 20111024

Abstract (en)

[origin: WO2012059187A1] The invention relates to methods for producing a laminate that is for contacting at least one electronic component. In said method, an insulating layer is arranged between a first metal layer and a second metal layer, the metal layers are contacted with each other, at least one cavity is produced in the insulating layer, the metal layers are laminated with the insulating layer, a recess is produced in the first metal layer for receiving the electronic component, and the electronic component is inserted therein. The invention also relates to a laminate produced by such a method, and to the use thereof as a circuit board, sensor, LED lamp, mobile phone component, control system, controller or mobile phone flash LED.

IPC 8 full level

H01L 23/13 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01)

CPC (source: EP KR US)

H01L 23/13 (2013.01 - EP KR US); H01L 23/3735 (2013.01 - EP US); H01L 23/498 (2013.01 - EP KR US); H05K 1/0298 (2013.01 - US); H05K 3/10 (2013.01 - US); H01L 33/60 (2013.01 - EP US); H01L 2224/32013 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48465 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); Y10T 29/49155 (2015.01 - EP US)

Citation (search report)

See references of WO 2012059187A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

DE 102010050342 A1 20120510; CN 103189977 A 20130703; EP 2636061 A1 20130911; KR 20130079632 A 20130710; US 2013215584 A1 20130822; WO 2012059187 A1 20120510

DOCDB simple family (application)

DE 102010050342 A 20101105; CN 201180053241 A 20111024; EP 11785581 A 20111024; EP 2011005340 W 20111024; KR 20137014502 A 20111024; US 201113880756 A 20111024