Global Patent Index - EP 2636062 A2

EP 2636062 A2 2013-09-11 - POWER SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING A SINTERED POWER SEMICONDUCTOR MODULE HAVING A TEMPERATURE SENSOR

Title (en)

POWER SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING A SINTERED POWER SEMICONDUCTOR MODULE HAVING A TEMPERATURE SENSOR

Title (de)

LEISTUNGSHALBLEITERMODUL UND VERFAHREN ZUR HERSTELLUNG EINES GESINTERTEN LEISTUNGSHALBLEITERMODULS MIT TEMPERATURFÜHLER

Title (fr)

MODULE À SEMI-CONDUCTEURS DE PUISSANCE ET PROCÉDÉ DE FABRICATION D'UN MODULE À SEMI-CONDUCTEURS DE PUISSANCE FRITTÉ COMPORTANT UNE SONDE DE TEMPÉRATURE

Publication

EP 2636062 A2 (DE)

Application

EP 11810558 A

Priority

  • DE 102010050315 A
  • DE 2011001905 W

Abstract (en)

[origin: WO2012062274A2] The invention relates to a method for producing electrical components that can be sintered, for jointly sintering with active components, wherein the components having a planar shape are provided with at least one flat lower face intended to be sintered, and an electrical contact area on the surface opposite the sintering surface is present in the form of a metal contact surface, which can be contacted at the top face by a common method from the following group: wire bonding or soldering or sintering or pressure contacting, wherein the component is a temperature sensor, on the lower face of which a metallization that can be sintered is provided on a ceramic body and on the ceramic body of which two electrical contact surfaces are provided for continuative electrical connection.

IPC 8 full level (invention and additional information)

H01L 23/15 (2006.01); G01K 7/18 (2006.01); H01L 23/34 (2006.01)

CPC (invention and additional information)

H01L 37/00 (2013.01); G01K 7/16 (2013.01); H01L 23/15 (2013.01); H01L 23/34 (2013.01); H01L 24/49 (2013.01); H01L 24/83 (2013.01); H01L 24/48 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/014 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01)

Combination set (CPC)

  1. H01L 2224/49111 + H01L 2224/48472 + H01L 2924/00
  2. H01L 2224/48472 + H01L 2224/48227 + H01L 2924/00
  3. H01L 2224/48091 + H01L 2924/00014
  4. H01L 2224/48472 + H01L 2224/48091 + H01L 2924/00
  5. H01L 2924/15787 + H01L 2924/00
  6. H01L 2924/00014 + H01L 2224/45099
  7. H01L 2924/00011 + H01L 2224/83205

Citation (search report)

See references of WO 2012062274A2

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

EPO simple patent family

DE 102010050315 A1 20120510; DE 102010050315 B4 20120531; DE 102010050315 C5 20141204; CN 103403862 A 20131120; CN 103403862 B 20160810; EP 2636062 A2 20130911; US 2013228890 A1 20130905; US 9040338 B2 20150526; WO 2012062274 A2 20120518; WO 2012062274 A3 20120726

INPADOC legal status


2016-10-05 [18D] APPLICATION DEEMED TO BE WITHDRAWN

- Effective date: 20160503

2014-02-12 [DAX] REQUEST FOR EXTENSION OF THE EUROPEAN PATENT (TO ANY COUNTRY) (DELETED)

2013-09-11 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20130425

2013-09-11 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A2

- Designated State(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR