EP 2638570 A1 20130918 - ADHESIVE COMPOUND AND METHOD FOR ENCAPSULATING AN ELECTRONIC ASSEMBLY
Title (en)
ADHESIVE COMPOUND AND METHOD FOR ENCAPSULATING AN ELECTRONIC ASSEMBLY
Title (de)
KLEBMASSE UND VERFAHREN ZUR KAPSELUNG EINER ELEKTRONISCHEN ANORDNUNG
Title (fr)
ADHÉSIF ET PROCÉDÉ D'ENCAPSULATION D'UN SYSTÈME ÉLECTRONIQUE
Publication
Application
Priority
- DE 102010043871 A 20101112
- EP 2011068822 W 20111027
Abstract (en)
[origin: WO2012062587A1] The invention relates to the use of an adhesive compound for encapsulating an (opto-)electronic application, containing an organometallically modified polymer created by reacting an elastomer with an organometallic compound, wherein the central atom of the organometallic compound is a metal or metalloid of the 3rd and 4th main groups or 3rd and 4th subgroups.
IPC 8 full level
C09J 109/06 (2006.01); C09J 153/00 (2006.01); H01L 23/29 (2006.01)
CPC (source: EP KR)
C09J 109/06 (2013.01 - EP KR); C09J 153/00 (2013.01 - KR); C09J 153/005 (2013.01 - EP); H01L 23/28 (2013.01 - KR); H01L 23/293 (2013.01 - EP); H01L 2924/0002 (2013.01 - EP); H01L 2924/12044 (2013.01 - EP)
Citation (search report)
See references of WO 2012062587A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102010043871 A1 20120516; CN 103348465 A 20131009; CN 103348465 B 20170208; EP 2638570 A1 20130918; KR 20130141588 A 20131226; TW 201241125 A 20121016; WO 2012062587 A1 20120518
DOCDB simple family (application)
DE 102010043871 A 20101112; CN 201180064864 A 20111027; EP 11779147 A 20111027; EP 2011068822 W 20111027; KR 20137015033 A 20111027; TW 100141033 A 20111110