EP 2645830 B1 20141008 - Method for manufacture of fine line circuitry
Title (en)
Method for manufacture of fine line circuitry
Title (de)
Herstellungsverfahren für Schaltungen mit feinen Linien
Title (fr)
Procédé de fabrication de circuit de ligne fine
Publication
Application
Priority
EP 12075035 A 20120329
Abstract (en)
[origin: EP2645830A1] The present invention relates to a method for manufacture of fine line circuitry in the manufacture of printed circuit boards, IC substrates and the like. The method utilizes a first conductive layer (10) on the smooth surface of a build-up layer (1) and a second conductive layer (11) selected from electrically conductive polymers, colloidal noble metals and electrically conductive carbon particles on the roughened walls of at least one opening which are formed after depositing the first conductive layer.
IPC 8 full level
H05K 3/42 (2006.01); C25D 5/02 (2006.01); C25D 5/54 (2006.01); H05K 3/46 (2006.01); H05K 3/10 (2006.01); H05K 3/38 (2006.01)
CPC (source: EP US)
C23C 18/1653 (2013.01 - EP US); C23C 18/2006 (2013.01 - EP US); C23C 18/40 (2013.01 - EP US); C25D 5/022 (2013.01 - EP US); C25D 5/56 (2013.01 - EP US); C25D 7/00 (2013.01 - EP US); C25D 7/06 (2013.01 - US); H05K 3/06 (2013.01 - US); H05K 3/381 (2013.01 - US); H05K 3/387 (2013.01 - EP US); H05K 3/389 (2013.01 - EP US); H05K 3/421 (2013.01 - EP US); H05K 3/4644 (2013.01 - EP US); C23C 18/2066 (2013.01 - EP US); C23C 18/30 (2013.01 - EP US); C23C 18/405 (2013.01 - EP US); C25D 3/38 (2013.01 - EP US); H05K 3/108 (2013.01 - EP US); H05K 3/388 (2013.01 - EP US); H05K 2203/0789 (2013.01 - EP US); H05K 2203/0793 (2013.01 - EP US); H05K 2203/0796 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2645830 A1 20131002; EP 2645830 B1 20141008; JP 2015513005 A 20150430; JP 5859167 B2 20160210; KR 101522154 B1 20150528; KR 20140142709 A 20141212; TW 201345351 A 20131101; TW I565379 B 20170101; US 2015083602 A1 20150326; US 9713266 B2 20170718; WO 2013143732 A1 20131003
DOCDB simple family (application)
EP 12075035 A 20120329; EP 2013052318 W 20130206; JP 2015502153 A 20130206; KR 20147027023 A 20130206; TW 102107120 A 20130227; US 201314373961 A 20130206