Title (en)

CIRCUIT COMPRISING A COMPONENT COVERED WITH A LID, METHOD FOR PRODUCING SUCH A CIRCUIT, AND DEVICE FOR IMPLEMENTING SAID METHOD

Title (de)

SCHALTUNG MIT EINER MIT EINEM DECKEL VERSEHENEN KOMPONENTE, VERFAHREN ZU IHRER HERSTELLUNG UND VORRICHTUNG ZUR UMSETZUNG DES VERFAHRENS

Title (fr)

CIRCUIT COMPORTANT UN COMPOSANT RECOUVERT D'UN CAPOT, PROCÉDÉ POUR RÉALISER UN TEL CIRCUIT ET DISPOSITIF POUR LA MISE EN OEUVRE DUDIT PROCÉDÉ

Publication

EP 2649006 A1 20131016 (FR)

Application

EP 11811048 A 20111208

Priority

• FR 1060259 A 20101208
• FR 2011052900 W 20111208

Abstract (en)

[origin: WO2012076818A1] The invention relates to an electronic circuit (1) consisting of a substrate (10) having a surface on which at least one component (3) covered with a lid (22) is mounted. Said component comprises first connection means (15) to be connected to second connection means (70). In said circuit (1), at least one connection passage (50) is provided that extends through the lid in order to link the first connection means (15) to the outside of the lid, which then makes it possible to link the first means to the second connection means (70) (see fig. 2). The invention can be used for the production of microsystems that require the encapsulation of some components.

IPC 8 full level

B81C 1/00 (2006.01)

CPC (source: EP US)

B29C 65/48 (2013.01 - US); B29C 66/001 (2013.01 - US); B81C 1/00301 (2013.01 - EP US); B81B 2207/095 (2013.01 - EP US); B81C 2203/0109 (2013.01 - EP US)

Citation (search report)

See references of WO 2012076818A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2012076818 A1 20120614; EP 2649006 A1 20131016; FR 2968647 A1 20120615; JP 2014503371 A 20140213; US 2014130966 A1 20140515

DOCDB simple family (application)

FR 2011052900 W 20111208; EP 11811048 A 20111208; FR 1060259 A 20101208; JP 2013542594 A 20111208; US 201113992510 A 20111208