EP 2652773 A2 20131023 - CHEMICAL MECHANICAL PLANARIZATION (CMP) PAD CONDITIONER AND METHOD OF MAKING
Title (en)
CHEMICAL MECHANICAL PLANARIZATION (CMP) PAD CONDITIONER AND METHOD OF MAKING
Title (de)
KONDITIONIERER FÜR EIN PAD FÜR CHEMISCH-MECHANISCHE PLANARISIERUNG (CMP) UND VERFAHREN ZU SEINER HERSTELLUNG
Title (fr)
CONDITIONNEUR DE TAMPON DE PLANARISATION CHIMICO-MÉCANIQUE (CMP) ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
- US 42256310 P 20101213
- US 2011064565 W 20111213
Abstract (en)
[origin: US2012149287A1] A method of forming a chemical mechanical planarization (CMP) pad conditioner includes placing abrasive grains on a major surface of a substrate, forming a binding composition at an exterior surface of the abrasive grains, and depositing a bonding layer over the surface of the substrate and a portion of the abrasive grains to secure the abrasive grains to the major surface of the substrate.
IPC 8 full level
H01L 21/304 (2006.01)
CPC (source: EP KR US)
B24B 53/017 (2013.01 - EP US); B24D 3/06 (2013.01 - EP US); B24D 18/00 (2013.01 - EP US); H01L 21/304 (2013.01 - KR)
Citation (search report)
See references of WO 2012082702A2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
US 2012149287 A1 20120614; CN 103299402 A 20130911; EP 2652773 A2 20131023; JP 2013544664 A 20131219; KR 20130088891 A 20130808; SG 191108 A1 20130731; TW 201246342 A 20121116; WO 2012082702 A2 20120621; WO 2012082702 A3 20130124
DOCDB simple family (application)
US 201113324146 A 20111213; CN 201180062917 A 20111213; EP 11849399 A 20111213; JP 2013543411 A 20111213; KR 20137017391 A 20111213; SG 2013045018 A 20111213; TW 100144718 A 20111205; US 2011064565 W 20111213