EP 2654076 A2 20131023 - Method of dicing a substrate
Title (en)
Method of dicing a substrate
Title (de)
Verfahren zum Zerteilen eines Substrats
Title (fr)
Procédé de découpage d'un substrat
Publication
Application
Priority
JP 2012093856 A 20120417
Abstract (en)
In a step of performing dicing by sticking a protective tape (2) for protecting a wafer surface, in order to obtain a dicing method which ensures that there is no paste residue on a chip side face and that the protective tape is prevented from peeling from the wafer (1) during the dicing and which is excellent in productivity, in a step of performing dicing by sticking a surface protective adhesive tape having an energy ray-curable adhesive layer on one surface of a substrate, thereby performing surface protection for the surface of the semiconductor wafer where an integrated circuit is to be formed, the energy ray-curable adhesive layer is cured by radiating energy rays (4) beforehand to an inner circumferential portion of the wafer, and dicing is performed, with the energy ray-curable adhesive layer kept in an uncured condition by ensuring that energy rays are not radiated to an outer peripheral portion.
IPC 8 full level
H01L 21/683 (2006.01); C09J 7/29 (2018.01)
CPC (source: EP KR US)
C08G 18/6229 (2013.01 - EP US); C08G 18/8029 (2013.01 - EP US); C08G 18/8116 (2013.01 - EP US); C09J 7/29 (2017.12 - EP US); C09J 175/16 (2013.01 - EP US); H01L 21/30 (2013.01 - KR); H01L 21/6836 (2013.01 - EP US); H01L 21/78 (2013.01 - KR US); C09J 2203/326 (2013.01 - EP US); H01L 2221/68327 (2013.01 - EP US); H01L 2221/6834 (2013.01 - EP US); H01L 2221/68381 (2013.01 - EP US)
Citation (applicant)
- JP 2003209073 A 20030725 - LINTEC CORP
- JP H0345107 B2 19910710
- JP H08274048 A 19961018 - SONY CORP
- JP 4151850 B2 20080917
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2654076 A2 20131023; CN 103377977 A 20131030; JP 2013222846 A 20131028; KR 20130117676 A 20131028; TW 201403694 A 20140116; US 2013273716 A1 20131017
DOCDB simple family (application)
EP 13163836 A 20130416; CN 201310132126 A 20130416; JP 2012093856 A 20120417; KR 20130040825 A 20130415; TW 102113667 A 20130417; US 201313863683 A 20130416