Global Patent Index - EP 2655951 A2

EP 2655951 A2 20131030 - INSULATION FOR THERMAL DECOUPLING OF TWO ADJACENT COMPONENTS

Title (en)

INSULATION FOR THERMAL DECOUPLING OF TWO ADJACENT COMPONENTS

Title (de)

ISOLIERUNG ZUR THERMISCHEN ENTKOPPLUNG ZWEIER ANEINANDERLIEGENDER BAUTEILE

Title (fr)

ISOLATION POUR LE DÉCOUPLAGE THERMIQUE DE DEUX ÉLÉMENTS STRUCTURAUX ADJACENTS

Publication

EP 2655951 A2 20131030 (DE)

Application

EP 11808133 A 20110622

Priority

  • DE 202010009547 U 20100625
  • DE 2011001330 W 20110622

Abstract (en)

[origin: WO2012010130A2] The invention relates to a component for thermally decoupling two adjacent components by means of novel insulation formed by a plurality of thin-layered discs of natural mica stacked one on top of the other. The invention enables two components to be thermally decoupled when temperature differences are very great and simultaneously shear and pressure loads are high.

IPC 8 full level

F16L 59/02 (2006.01); F16D 65/78 (2006.01)

CPC (source: EP)

F16D 65/14 (2013.01); F16D 65/78 (2013.01); F16D 2065/785 (2013.01); F16D 2125/58 (2013.01)

Citation (search report)

See references of WO 2012010130A2

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

DE 202010009547 U1 20100916; DE 112011104086 A5 20130919; EP 2655951 A2 20131030; WO 2012010130 A2 20120126; WO 2012010130 A3 20130926

DOCDB simple family (application)

DE 202010009547 U 20100625; DE 112011104086 T 20110622; DE 2011001330 W 20110622; EP 11808133 A 20110622