EP 2656150 A2 20131030 - ASSEMBLY PROCESS OF A COMPONENT WHICH DOES NOT HAVE A PLASTIC DOMAIN
Title (en)
ASSEMBLY PROCESS OF A COMPONENT WHICH DOES NOT HAVE A PLASTIC DOMAIN
Title (de)
MONTAGEVERFAHREN EINER KOMPONENTE OHNE KUNSTSTOFFBEREICH
Title (fr)
PROCÉDÉ D'ASSEMBLAGE D'UNE PIÈCE NE COMPORTANT PAS DE DOMAINE PLASTIQUE
Publication
Application
Priority
- EP 10196597 A 20101222
- EP 2011070693 W 20111122
- EP 11787857 A 20111122
Abstract (en)
[origin: EP2469353A1] The assembly has a plasticless component including perforations (26) forming elastic deformation units distributed around a circular opening of the component. A metal or metal alloy based axially extending unit e.g. steel pivot pin (27), has a radially flared and elastically and plastically deformed part (24) that clamps a plasticless component's wall surrounding the opening, in a radial direction (B) by stressing the elastic deformation unit to join the component and the extending unit in a non-destructive manner. An independent claim is also included for a method for assembling a metal or metal alloy based unit in a silicon based component.
IPC 8 full level
B81C 3/00 (2006.01); G04B 1/14 (2006.01); G04B 13/02 (2006.01); G04B 15/14 (2006.01); G04B 17/32 (2006.01); G04B 17/34 (2006.01); G04D 1/00 (2006.01); G04D 3/04 (2006.01)
CPC (source: EP US)
G04B 1/145 (2013.01 - US); G04B 13/02 (2013.01 - US); G04B 13/021 (2013.01 - EP US); G04B 13/022 (2013.01 - EP US); G04B 15/14 (2013.01 - EP US); G04B 17/32 (2013.01 - US); G04B 17/325 (2013.01 - EP US); G04B 17/345 (2013.01 - EP US); G04D 1/0042 (2013.01 - EP US); G04D 3/04 (2013.01 - EP US); Y10T 29/49581 (2015.01 - EP US)
Citation (search report)
See references of WO 2012084384A2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2469353 A1 20120627; CN 103299245 A 20130911; CN 103299245 B 20160615; EP 2656150 A2 20131030; EP 2656150 B1 20170104; HK 1189281 A1 20140530; JP 2014501923 A 20140123; JP 5671155 B2 20150218; TW 201240763 A 20121016; TW I564107 B 20170101; US 2013286795 A1 20131031; US 9128463 B2 20150908; WO 2012084384 A2 20120628; WO 2012084384 A3 20120816
DOCDB simple family (application)
EP 10196597 A 20101222; CN 201180062121 A 20111122; EP 11787857 A 20111122; EP 2011070693 W 20111122; HK 14102273 A 20140306; JP 2013545143 A 20111122; TW 100143940 A 20111130; US 201113995052 A 20111122