EP 2665122 A1 20131120 - NON-RECIPROCAL CIRCUIT ELEMENT
Title (en)
NON-RECIPROCAL CIRCUIT ELEMENT
Title (de)
NICHTREZIPROKES SCHALTUNGSELEMENT
Title (fr)
ÉLÉMENT DE CIRCUIT NON RÉCIPROQUE
Publication
Application
Priority
- JP 2011005729 A 20110114
- JP 2011033034 A 20110218
- JP 2011007194 W 20111222
Abstract (en)
There is provided a non-reciprocal circuit element which has a simple structure and superiority in assembly and allows easy achievement of height reduction and size reduction while preventing fracture of a ferrite plate. In the present invention, a central conductor 1 in which respective resonators 3 extending outward are formed between I/O terminals 2a to 2c extending outward in a Y-shape from a central portion, upper and lower ferrite plates 5 and 6 between which the central conductor 1 together with the resonators 3 is sandwiched, and upper and lower magnetic metal plates 7 and 8 between which the upper and lower ferrite plates are sandwiched are stacked, a magnet 10 is arranged on the upper magnetic metal plate 7, and bent portions 4 which are bent in out-of-plane directions and form an interstice G between the central conductor 1 and the upper ferrite plate 5 are formed at respective distal end portions 3a of the resonators 3 of the central conductor 1 such that the upper ferrite plate 5 is provided to be capable of coming into and out of contact with the central conductor 1 due to the elasticity of the bent portions 4 The prevent invention also provides a non-reciprocal circuit element which can obtain good circulator characteristics without excessively increasing the magnetic field strength of a magnet and can be used in a wide band including a high frequency band in particular. To this end, in a non-reciprocal circuit element in which the I/O terminals 2a to 2c are integrally formed, and the upper and lower magnetic metal plates 7 and 8 form a closed magnetic circuit via side plates 9, the upper magnetic metal plate 7 is formed of a material having magnetic permeability lower than that of pure iron and/or is formed to have a thickness t smaller than a thickness T of the lower magnetic metal plate 8
IPC 8 full level
H01P 1/36 (2006.01); H01P 1/387 (2006.01)
CPC (source: EP US)
H01P 1/38 (2013.01 - US); H01P 1/387 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2665122 A1 20131120; EP 2665122 A4 20140702; EP 2665122 B1 20160302; CN 103384938 A 20131106; CN 103384938 B 20150617; US 2013285759 A1 20131031; US 9118102 B2 20150825; WO 2012095933 A1 20120719
DOCDB simple family (application)
EP 11855819 A 20111222; CN 201180064941 A 20111222; JP 2011007194 W 20111222; US 201113996727 A 20111222