Global Patent Index - EP 2667137 B1

EP 2667137 B1 20180425 - Modular thermosiphon and cooling housing

Title (en)

Modular thermosiphon and cooling housing

Title (de)

Modularer Thermosyphon und Kühlgehäuse

Title (fr)

Thermosiphon modulaire et carter de refroidissement

Publication

EP 2667137 B1 20180425 (DE)

Application

EP 12004062 A 20120524

Priority

EP 12004062 A 20120524

Abstract (en)

[origin: EP2667137A1] The thermosyphon (20) has multiple parallelepiped-like thermosyphon modules (28,30,32) that are equipped with a condenser (22) and an evaporator (26). The condenser and evaporator which extend transverse to multiple ribs, are separated from each other by multiple barrier walls (38,40,42). The thermosyphon modules are arranged adjacent to each other in a common plane (24) with respect to the barrier walls. The barrier walls are bent at the adjacent sides, such that the common angled contact surfaces (44,46) are respectively formed at the angled side portions. An independent claim is included for a cooling cabinet.

IPC 8 full level

F28D 15/02 (2006.01); F28F 9/00 (2006.01); H01F 27/18 (2006.01)

CPC (source: EP)

F28D 15/0233 (2013.01); F28D 15/0275 (2013.01); F28F 9/005 (2013.01); H01F 27/18 (2013.01); F28F 1/126 (2013.01); F28F 2230/00 (2013.01); F28F 2240/00 (2013.01); H01F 27/085 (2013.01)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 2667137 A1 20131127; EP 2667137 B1 20180425; WO 2013174470 A1 20131128

DOCDB simple family (application)

EP 12004062 A 20120524; EP 2013001255 W 20130426