EP 2671661 B1 20170405 - SOLDERING DEVICE AND METHOD, AND MANUFACTURED SUBSTRATE AND ELECTRONIC COMPONENT
Title (en)
SOLDERING DEVICE AND METHOD, AND MANUFACTURED SUBSTRATE AND ELECTRONIC COMPONENT
Title (de)
LÖTVORRICHTUNG UND -VERFAHREN SOWIE DAMIT HERGESTELLTES SUBSTRAT UND ELEKTRONISCHE KOMPONENTE
Title (fr)
DISPOSITIF ET PROCÉDÉ DE BRASAGE, ET SUBSTRAT ET COMPOSANT ÉLECTRONIQUE FABRIQUÉS
Publication
Application
Priority
JP 2012060191 W 20120414
Abstract (en)
[origin: US2013269984A1] Provided are a soldering device and a soldering method which allow for soldering at low cost with high yield and high reliability. The soldering device has: first organic fatty acid-containing solution bath 21 in which workpiece member 10 having a copper electrode is immersed in organic fatty acid-containing solution 31a; space section 24 having a steam atmosphere of organic fatty acid-containing solution 31b, the space section horizontally having ejection unit 33 to spray a jet stream of a molten solder to the copper electrode provided on workpiece member 10 and ejection unit 34 to spray a liquid to an excess of the molten solder for removal; and second organic fatty acid-containing solution bath 23 in which workpiece member 10 from which the excess of the molten solder is removed in space section 24 is immersed again in organic fatty acid-containing solution 31c.
IPC 8 full level
B23K 1/018 (2006.01); B23K 1/08 (2006.01); B23K 1/20 (2006.01); B23K 35/26 (2006.01); H05K 3/34 (2006.01)
CPC (source: EP KR US)
B23K 1/0016 (2013.01 - EP KR US); B23K 1/20 (2013.01 - EP KR US); B23K 1/206 (2013.01 - EP US); B23K 3/0607 (2013.01 - EP KR US); B23K 3/0692 (2013.01 - EP KR US); H05K 1/0296 (2013.01 - KR US); B23K 2101/36 (2018.07 - KR); H01L 2924/14 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
US 2013269984 A1 20131017; US 9149883 B2 20151006; CN 103459075 A 20131218; CN 103459075 B 20161123; EP 2671661 A1 20131211; EP 2671661 A4 20160427; EP 2671661 B1 20170405; JP 5079169 B1 20121121; JP WO2013153674 A1 20151217; KR 101702171 B1 20170202; KR 20150005419 A 20150114; TW 201346070 A 20131116; TW I554648 B 20161021; WO 2013153674 A1 20131017
DOCDB simple family (application)
US 201213819555 A 20120414; CN 201280002628 A 20120414; EP 12829099 A 20120414; JP 2012060191 W 20120414; JP 2012518678 A 20120414; KR 20137005089 A 20120414; TW 102106986 A 20130227