EP 2682441 A1 20140108 - A chemical mechanical polishing (CMP) composition comprising a non-ionic surfactant and an aromatic compound comprising at least one acid group
Title (en)
A chemical mechanical polishing (CMP) composition comprising a non-ionic surfactant and an aromatic compound comprising at least one acid group
Title (de)
Chemisch-mechanische Polierzusammensetzung mit einem nicht ionischen Tensid und einer Aromaverbindung mit mindestens einer Säuregruppe
Title (fr)
Composition de polissage mécanique et chimique (CMP) comprenant un tensioactif non ionique et un composé aromatique comprenant au moins un groupe acide
Publication
Application
Priority
EP 12175333 A 20120706
Abstract (en)
A chemical mechanical polishing (CMP) composition (Q) comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) a non-ionic surfactant, (C) an aromatic compound comprising at least one acid group (Y), or a salt thereof, and (M) an aqueous medium.
IPC 8 full level
C09G 1/02 (2006.01); H01L 21/321 (2006.01)
CPC (source: EP IL KR)
C09G 1/02 (2013.01 - EP IL KR); C09K 3/1409 (2013.01 - IL KR); C09K 3/1436 (2013.01 - IL KR); C09K 3/1463 (2013.01 - IL KR); H01L 21/30625 (2013.01 - IL KR); H01L 21/3212 (2013.01 - EP IL KR)
Citation (applicant)
- US 2009032765 A1 20090205 - BIAN JINRU [US], et al
- US 2009311864 A1 20091217 - YAMADA TOORU [JP], et al
- WO 2004063301 A1 20040729 - AIR PROD & CHEM [US]
Citation (search report)
- [X] WO 2004033574 A1 20040422 - CABOT MICROELECTRONICS CORP [US]
- [X] US 2007054495 A1 20070308 - COMPTON TIMOTHY F [US], et al
- [X] WO 2011005456 A2 20110113 - CABOT MICROELECTRONICS CORP [US], et al
- [X] US 2006046490 A1 20060302 - BANERJEE GAUTAM [US], et al
- [X] WO 9813218 A1 19980402 - RODEL INC [US]
- [A] WO 2009056491 A1 20090507 - BASF SE [DE], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2682441 A1 20140108; CN 104412316 A 20150311; CN 104412316 B 20180420; EP 2870599 A2 20150513; EP 2870599 A4 20160330; EP 2870599 B1 20181017; IL 236194 A0 20150129; IL 236194 B 20200730; JP 2015530420 A 20151015; JP 6185578 B2 20170823; KR 102147073 B1 20200825; KR 20150036422 A 20150407; MY 170292 A 20190717; RU 2015103812 A 20160827; RU 2636511 C2 20171123; SG 11201408785V A 20150129; TW 201406889 A 20140216; TW I601794 B 20171011; WO 2014006546 A2 20140109; WO 2014006546 A3 20140227
DOCDB simple family (application)
EP 12175333 A 20120706; CN 201380036022 A 20130627; EP 13812480 A 20130627; IB 2013055273 W 20130627; IL 23619414 A 20141211; JP 2015519449 A 20130627; KR 20157003200 A 20130627; MY PI2014003626 A 20130627; RU 2015103812 A 20130627; SG 11201408785V A 20130627; TW 102124293 A 20130705