EP 2687006 A1 20140122 - IMAGE SENSOR MODULE AND METHOD FOR PRODUCING SUCH A MODULE
Title (en)
IMAGE SENSOR MODULE AND METHOD FOR PRODUCING SUCH A MODULE
Title (de)
BILDSENSOR-MODUL UND VERFAHREN ZUM HERSTELLEN EINES SOLCHEN
Title (fr)
MODULE DE CAPTEUR D'IMAGE ET PROCÉDÉ DE FABRICATION DUDIT MODULE DE CAPTEUR D'IMAGE
Publication
Application
Priority
- DE 102011005629 A 20110316
- EP 2012050565 W 20120116
Abstract (en)
[origin: WO2012123142A1] The invention relates to an image sensor module comprising an image sensor carrier and an image sensor, wherein the image sensor carrier is in the form of an injection-moulded circuit carrier, and wherein the image sensor is arranged on the image sensor carrier, and wherein the image sensor carrier comprises at least one holding means integrally formed on the image sensor carrier. The invention likewise relates to a method for producing an image sensor module and to a use.
IPC 8 full level
H04N 5/225 (2006.01)
CPC (source: EP US)
B60R 11/04 (2013.01 - EP US); H01L 27/14618 (2013.01 - EP US); H01L 27/14683 (2013.01 - EP US); H04N 23/55 (2023.01 - EP US); H04N 23/57 (2023.01 - EP US); B60R 2011/0026 (2013.01 - EP US); H01L 2224/16 (2013.01 - EP US)
Citation (search report)
See references of WO 2012123142A1
Citation (examination)
- US 2010328525 A1 20101230 - LEE SOO-BONG [KR], et al
- JP H0996749 A 19970408 - FUJI PHOTO OPTICAL CO LTD
- US 2006186317 A1 20060824 - FARNWORTH WARREN M [US], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102011005629 A1 20120920; CN 103444166 A 20131211; EP 2687006 A1 20140122; JP 2014512563 A 20140522; US 2014061438 A1 20140306; US 9401379 B2 20160726; WO 2012123142 A1 20120920
DOCDB simple family (application)
DE 102011005629 A 20110316; CN 201280013507 A 20120116; EP 12700398 A 20120116; EP 2012050565 W 20120116; JP 2013557016 A 20120116; US 201214004632 A 20120116