EP 2688858 A1 20140129 - BOND LAYERS FOR CERAMIC OR CERAMIC MATRIX COMPOSITE SUBSTRATES
Title (en)
BOND LAYERS FOR CERAMIC OR CERAMIC MATRIX COMPOSITE SUBSTRATES
Title (de)
BINDUNGSSCHICHTEN FÜR KERAMISCHE ODER KERAMIKMATRIXVERBUNDSUBSTRATE
Title (fr)
COUCHES DE LIAISON POUR DES SUBSTRATS CÉRAMIQUES OU EN COMPOSITE À MATRICE CÉRAMIQUE
Publication
Application
Priority
- US 201161466556 P 20110323
- US 2012030174 W 20120322
Abstract (en)
[origin: WO2012129431A1] A bond layer may include a composition that may be stable at temperatures above about 1410° C. An article may include a substrate, a bond layer formed on the substrate, and an overlayer formed over the bond layer. In some examples, the bond layer may include a substantially homogeneous mixture of Si and at least one of SiO2, Al2O3, ZrO2, a rare earth oxide, ZrSiO4, TiO2, Ta2O5, B2O3, an alkali metal oxide, or an alkali earth metal oxide. In other examples, the bond layer may include Si, an alkali metal oxide, and at least one of SiO2, Al2O3, ZrO2, HfO2, a rare earth oxide, ZrSiO4, HfSiO4, TiO2, Ta2O5, B2O3, or an alkali earth metal oxide. In other examples, the bond layer may include B2O3.
IPC 8 full level
C04B 41/89 (2006.01); F01D 5/28 (2006.01)
CPC (source: EP US)
C04B 41/009 (2013.01 - EP US); C04B 41/52 (2013.01 - EP US); C04B 41/89 (2013.01 - EP US); C23C 28/04 (2013.01 - EP US); F01D 25/005 (2013.01 - US)
C-Set (source: EP US)
EP
- C04B 41/009 + C04B 35/565 + C04B 35/806
- C04B 41/009 + C04B 35/584 + C04B 35/806
- C04B 41/52 + C04B 41/5027 + C04B 41/5096
- C04B 41/52 + C04B 41/5006 + C04B 41/5096 + C04B 41/522
- C04B 41/52 + C04B 41/4529 + C04B 41/5035 + C04B 41/5042 + C04B 41/5045 + C04B 41/5096 + C04B 41/522
- C04B 41/52 + C04B 41/502 + C04B 41/5042
- C04B 41/52 + C04B 41/5024 + C04B 41/522
- C04B 41/52 + C04B 41/5024 + C04B 41/5096 + C04B 41/522
- C04B 41/52 + C04B 41/5031 + C04B 41/5035 + C04B 41/5045 + C04B 41/522
US
- C04B 41/52 + C04B 41/5027 + C04B 41/5096
- C04B 41/52 + C04B 41/5006 + C04B 41/5096 + C04B 41/522
- C04B 41/52 + C04B 41/4529 + C04B 41/5035 + C04B 41/5042 + C04B 41/5045 + C04B 41/5096 + C04B 41/522
- C04B 41/52 + C04B 41/502 + C04B 41/5042
- C04B 41/52 + C04B 41/5024 + C04B 41/522
- C04B 41/52 + C04B 41/5024 + C04B 41/5096 + C04B 41/522
- C04B 41/52 + C04B 41/5031 + C04B 41/5035 + C04B 41/5045 + C04B 41/522
Citation (search report)
See references of WO 2012129431A1
Citation (examination)
- WO 2007098152 A2 20070830 - LEE KANG N [US]
- WO 0064836 A1 20001102 - GEN ELECTRIC [US]
- EP 1925694 A2 20080528 - UNITED TECHNOLOGIES CORP [US]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2012129431 A1 20120927; EP 2688858 A1 20140129; US 2014072816 A1 20140313
DOCDB simple family (application)
US 2012030174 W 20120322; EP 12714117 A 20120322; US 201214006848 A 20120322