EP 2689230 A1 20140129 - LASER MICRODISSECTION METHOD AND LASER MICRODISSECTION DEVICE
Title (en)
LASER MICRODISSECTION METHOD AND LASER MICRODISSECTION DEVICE
Title (de)
LASER-MIKRODISSEKTIONSVERFAHREN UND LASER-MIKRODISSEKTIONSVORRICHTUNG
Title (fr)
PROCÉDÉ DE MICRODISSECTION AU LASER ET DISPOSITIF DE MICRODISSECTION AU LASER
Publication
Application
Priority
- DE 102011001474 A 20110322
- EP 2012055034 W 20120321
Abstract (en)
[origin: WO2012126961A1] The invention relates to methods and devices for laser microdissection. For example, at least one first system parameter is adjusted, for example varied, by a user, and at least one second system parameter of the laser microdissection system is automatically adjusted by the laser microdissection system such that a cutting line has a desired cutting line parameter.
IPC 8 full level
G01N 1/28 (2006.01)
CPC (source: EP US)
B23K 26/0006 (2013.01 - EP US); B23K 26/38 (2013.01 - US); G01N 1/286 (2013.01 - EP US); B23K 2103/30 (2018.07 - EP US); G01N 2001/2886 (2013.01 - EP US); G05B 2219/45041 (2013.01 - US)
Citation (search report)
See references of WO 2012126961A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DE 102011001474 A1 20120927; EP 2689230 A1 20140129; EP 2689230 B1 20200506; US 2014190946 A1 20140710; US 9664599 B2 20170530; WO 2012126961 A1 20120927
DOCDB simple family (application)
DE 102011001474 A 20110322; EP 12717208 A 20120321; EP 2012055034 W 20120321; US 201214005575 A 20120321