EP 2690380 A1 20140129 - Apparatus including a heat pump and method to operate an apparatus including the heat pump
Title (en)
Apparatus including a heat pump and method to operate an apparatus including the heat pump
Title (de)
Vorrichtung mit einer Wärmepumpe und Verfahren zur Bedienung einer Vorrichtung mit der Wärmepumpe
Title (fr)
Appareil comprenant une pompe à chaleur et procédé pour faire fonctionner un appareil comprenant la pompe à chaleur
Publication
Application
Priority
EP 12178075 A 20120726
Abstract (en)
The invention relates to a method to operate an apparatus (1) including a heat pump (30) to warm up or to cool down a process medium. The apparatus (1) includes a heat pump (30) having a refrigerant circuit (38) in which a refrigerant can flow, said refrigerant circuit (38) including a first heat exchanger (31) where the refrigerant is cooled off, a second heat exchanger (32) where the refrigerant is heated up, a compressor (33) to pressurize and circulate the refrigerant through the refrigerant circuit, said compressor (33) including a lubricant, and a pressure-lowering device (34); said first and/or second heat exchanger being apt to perform heat exchange between said refrigerant flowing in said refrigerant circuit (38) and said process medium. The method includes: monitoring the temperature and/or pressure value of said refrigerant in a location (35a,35b,35c,35d) within said refrigerant circuit (38); and determining lubricant trapping within said refrigerant circuit (38) on the basis of said temperature and/or pressure values versus time.
IPC 8 full level
F25B 31/00 (2006.01)
CPC (source: EP)
F25B 31/00 (2013.01); F25B 31/004 (2013.01); F25B 2313/031 (2013.01); F25B 2500/16 (2013.01)
Citation (applicant)
- EP 1405946 A2 20040407 - SANYO ELECTRIC CO [JP]
- US 2005086827 A1 20050428 - NAGAE ETSUSHI [JP], et al
- JP 2005061348 A 20050310 - MATSUSHITA ELECTRIC IND CO LTD
Citation (search report)
- [XI] WO 2008024110 A1 20080228 - CARRIER CORP [US], et al
- [XI] US 2005126193 A1 20050616 - LIFSON ALEXANDER [US], et al
- [XI] WO 2008117530 A1 20081002 - DAIKIN IND LTD [JP], et al
- [A] JP 2009273488 A 20091126 - TOSHIBA CORP, et al
- [A] US 2007107255 A1 20070517 - TAMURA TOMOICHIRO [JP], et al
- [A] GB 2227577 A 19900801 - TOSHIBA KK [JP]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DOCDB simple family (application)
EP 12178075 A 20120726; EP 2013065628 W 20130724