EP 2693570 B1 20170426 - Contact assembly for electrically contacting a circuit board
Title (en)
Contact assembly for electrically contacting a circuit board
Title (de)
Kontaktanordnung zum elektrischen Kontaktieren einer Leiterplatte
Title (fr)
Agencement de contact pour la mise en contact électrique d'une carte de circuit imprimé
Publication
Application
Priority
DE 102012213806 A 20120803
Abstract (en)
[origin: EP2693570A1] The arrangement (14) has contact elements (15) for electrically contacting a printed circuit board (PCB) (10). The contact elements include electrically conductive contact surfaces (18) for electrical contacting of a spring element of a plug. The contact surfaces are provided at oppositely lying surfaces of the PCB. The contact elements include spacer elements (16a), which are carried by the PCB and carry the contact surfaces, so that contact surfaces include a spacing to a surface of the PCB. The spacer elements are curved over a surface of the PCB.
IPC 8 full level
H01R 12/57 (2011.01); H01R 12/71 (2011.01); H01R 13/24 (2006.01)
CPC (source: EP)
H01R 12/57 (2013.01); H01R 12/718 (2013.01); H01R 13/24 (2013.01)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2693570 A1 20140205; EP 2693570 B1 20170426; DE 102012213806 A1 20140206
DOCDB simple family (application)
EP 13177445 A 20130722; DE 102012213806 A 20120803