Global Patent Index - EP 2695956 A2

EP 2695956 A2 20140212 - COPPER ALLOY SHEET

Title (en)

COPPER ALLOY SHEET

Title (de)

KUPFERLEGIERUNGSBLECH

Title (fr)

TÔLE EN ALLIAGE DE CUIVRE

Publication

EP 2695956 A2 20140212 (EN)

Application

EP 13005147 A 20080724

Priority

  • JP 2007205630 A 20070807
  • JP 2007232641 A 20070907
  • JP 2007252036 A 20070927
  • JP 2007252037 A 20070927
  • EP 08791572 A 20080724
  • JP 2008063320 W 20080724

Abstract (en)

The present invention relates to a Cu-Ni-Sn-P-based copper alloy sheet having a specific composition, where the texture of the copper alloy sheet is set to a texture such that the distribution density of B orientation and the sum of distribution densities ofB orientation, S orientation and Cu orientation each is set to fall in a specific range and bendability is thereby enhanced The Cu-Ni-Sn-P-based copper alloy sheet of the present invention is excellent in the properties required for a terminal or connector and further has excellent bendability.

IPC 8 full level

C22C 9/06 (2006.01); C22C 9/00 (2006.01); C22C 9/02 (2006.01); C22F 1/08 (2006.01); H01R 13/03 (2006.01); H01R 13/11 (2006.01); H01R 43/16 (2006.01)

CPC (source: EP US)

C22C 9/00 (2013.01 - EP US); C22C 9/02 (2013.01 - EP US); C22C 9/06 (2013.01 - EP US); C22F 1/08 (2013.01 - EP US); H01R 13/03 (2013.01 - EP US); H01R 13/11 (2013.01 - EP US); H01R 43/16 (2013.01 - EP US)

Citation (applicant)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 2184371 A1 20100512; EP 2184371 A4 20130501; EP 2184371 B1 20161130; CN 101743333 A 20100616; EP 2695956 A2 20140212; EP 2695956 A3 20140618; EP 2695956 B1 20181219; EP 2695957 A2 20140212; EP 2695957 A3 20140702; EP 2695957 B1 20181128; EP 2695958 A2 20140212; EP 2695958 A3 20140702; EP 2695958 B1 20181226; KR 101227315 B1 20130128; KR 20100031138 A 20100319; US 2011223056 A1 20110915; WO 2009019990 A1 20090212

DOCDB simple family (application)

EP 08791572 A 20080724; CN 200880024723 A 20080724; EP 13005147 A 20080724; EP 13005148 A 20080724; EP 13005149 A 20080724; JP 2008063320 W 20080724; KR 20107002597 A 20080724; US 67209208 A 20080724