EP 2698583 A4 20160106 - CAVITY FOR A HEAT-PROCESSING DEVICE, A HEAT-PROCESSING DEVICE COMPRISING SAME, AND AN AUXILIARY IMPLEMENT FOR THE HEAT-PROCESSING DEVICE
Title (en)
CAVITY FOR A HEAT-PROCESSING DEVICE, A HEAT-PROCESSING DEVICE COMPRISING SAME, AND AN AUXILIARY IMPLEMENT FOR THE HEAT-PROCESSING DEVICE
Title (de)
RESONATOR FÜR EINE WÄRMEBEHANDLUNGSVORRICHTUNG, WÄRMEBEHANDLUNGSVORRICHTUNG DAMIT UND HILFSVORRICHTUNG FÜR DIE WÄRMEBEHANDLUNGSVORRICHTUNG
Title (fr)
CAVITÉ POUR UN DISPOSITIF DE TRAITEMENT THERMIQUE, DISPOSITIF DE TRAITEMENT THERMIQUE LA COMPRENANT ET INSTRUMENT AUXILIAIRE POUR LE DISPOSITIF DE TRAITEMENT THERMIQUE
Publication
Application
Priority
- KR 20110033522 A 20110412
- KR 2012002737 W 20120411
Abstract (en)
[origin: EP2698583A2] The present invention relates to a cavity for a heat-processing device, to a heat-processing device comprising same, and to an auxiliary implement for the heat-processing device. One embodiment of the present invention concerns a cavity which is contained on the inside of the main body of a heat-processing device and constitutes a space where an article to be processed is heated, wherein the cavity of the heat-processing device comprises: a porous oxide layer which is formed by means of an anodizing reaction on at least some of the surface of the cavity; and a catalyst layer which is formed by causing a catalyst source solution to be supported on at least some of the surface of the oxide layer.
IPC 8 full level
F24C 7/00 (2006.01); F24C 15/00 (2006.01)
CPC (source: EP KR)
F24C 7/00 (2013.01 - KR); F24C 14/00 (2013.01 - EP); F24C 15/005 (2013.01 - EP); F24C 15/007 (2013.01 - EP); F24C 15/08 (2013.01 - KR)
Citation (search report)
- [XY] US 3266477 A 19660816 - STILES ALVIN B
- [Y] CN 1727756 A 20060201 - LG ELECTRONICS TIANJIN [CN]
- [X] US 2009050129 A1 20090226 - ROBINSON JR JOHN W [US]
- [X] JP H03161053 A 19910711 - MATSUSHITA ELECTRIC IND CO LTD
- [X] EP 1232790 A1 20020821 - KAWASAKI HEAVY IND LTD [JP]
- [A] US 2537433 A 19510109 - WARING CHARLES E
- [A] JP 2010234278 A 20101021 - HITACHI AIC INC
- See references of WO 2012141485A2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2698583 A2 20140219; EP 2698583 A4 20160106; EP 2698583 B1 20190612; CN 103459929 A 20131218; JP 2014514531 A 20140619; KR 101280954 B1 20130708; KR 20120116027 A 20121022; WO 2012141485 A2 20121018; WO 2012141485 A3 20130110
DOCDB simple family (application)
EP 12771691 A 20120411; CN 201280018212 A 20120411; JP 2014505074 A 20120411; KR 20110033522 A 20110412; KR 2012002737 W 20120411