EP 2703449 A4 20141008 - HEAT RESISTANT POLYAMIDE COMPOSITION AND APPLICATION THEREOF
Title (en)
HEAT RESISTANT POLYAMIDE COMPOSITION AND APPLICATION THEREOF
Title (de)
HITZEBESTÄNDIGE POLYAMIDZUSAMMENSETZUNG UND IHRE VERWENDUNG
Title (fr)
COMPOSITION DE POLYAMIDE RÉSISTANTE À LA CHALEUR ET SON APPLICATION
Publication
Application
Priority
- CN 201110304713 A 20111010
- CN 2011002050 W 20111208
Abstract (en)
[origin: EP2703449A1] The present invention discloses a heat-resistant polyamide composition and application thereof. The composition comprises the following components in percentage by weight: 40% to 90% of heat-resistant polyamide resin, 5% to 35% of mineral fiber A, 0 to 35% of mineral filler B, 0.1% to 1% of light stabilizer, 0.1% to 1% of flow modifier and 0.1% to 1% of antioxidant. In the present invention, heat-resistant polyamide resin with the ratio of amine-terminated group and carboxyl-terminated group between 0.1 and 0.8 is selected to be matched with deformed glass fibers with an aspect ratio of 2 to 6, the mineral filler B and the flow modifier to obtain the heat-resistant polyamide composition. The heat-resistant polyamide composition not only has high initial whiteness, high reflectivity and excellent heat resistance, but also has good moldability and good dimensional stability; therefore, the heat-resistant polyamide composition is capable of being applied for preparing the reflecting supports for such light sources as LCD backlight of portable phones, computers, televisions and the like, as well as headlights of automotive vehicles, instrument panels and lighting appliances, etc.
IPC 8 full level
C08L 77/06 (2006.01); C08K 3/22 (2006.01); C08K 7/08 (2006.01); C08K 7/10 (2006.01); C08K 7/14 (2006.01); C08K 13/04 (2006.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01)
CPC (source: EP KR US)
C08K 3/22 (2013.01 - EP KR US); C08K 7/04 (2013.01 - EP US); C08K 7/08 (2013.01 - KR); C08K 7/10 (2013.01 - KR); C08K 7/14 (2013.01 - EP KR US); C08K 13/04 (2013.01 - KR US); C08L 77/06 (2013.01 - KR); C08K 2003/2241 (2013.01 - EP US); C08K 2003/2296 (2013.01 - EP US); H01L 33/60 (2013.01 - EP US)
Citation (search report)
- [Y] CN 101456949 A 20090617 - KINGFA TECHNOLOGY CO LTD [CN]
- [YD] US 2009088507 A1 20090402 - OGASAWARA HIDETO [JP]
- [A] WO 2006135841 A1 20061221 - DU PONT [US], et al
- [A] EP 1693418 A1 20060823 - MITSUI CHEMICALS INC [JP]
- [A] EP 1266930 A1 20021218 - KURARAY CO [JP]
- See references of WO 2013053086A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2703449 A1 20140305; EP 2703449 A4 20141008; EP 2703449 B1 20160629; CN 102372921 A 20120314; CN 102372921 B 20130508; JP 2014517119 A 20140717; JP 5706583 B2 20150422; KR 20140043901 A 20140411; US 2014303293 A1 20141009; US 9051454 B2 20150609; WO 2013053086 A1 20130418
DOCDB simple family (application)
EP 11873964 A 20111208; CN 2011002050 W 20111208; CN 201110304713 A 20111010; JP 2014515019 A 20111208; KR 20137033418 A 20111208; US 201114351127 A 20111208