EP 2704537 A1 20140305 - WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING SAME
Title (en)
WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING SAME
Title (de)
VERDRAHTUNGSSUBSTRAT, MEHRTEILIGES VERDRAHTUNGSSUBSTRAT UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
SUBSTRAT DE CÂBLAGE, SUBSTRAT DE CÂBLAGE EN PLUSIEURS MORCEAUX ET PROCÉDÉ DE FABRICATION DE CEUX-CI
Publication
Application
Priority
- JP 2011096829 A 20110425
- JP 2012000671 W 20120201
Abstract (en)
Provided are a wiring substrate including a substrate main body and a metalized layer provided on the front surface of the substrate main body so as to extend along side surfaces thereof, in which a plating film and a brazing material layer covering the surface of the metalized layer are not damaged; a multi-piece wiring substrate array for simultaneously providing a plurality of the wiring substrates; and a method for producing the multi-piece wiring substrate array. The wiring substrate 1a includes a substrate main body 2 which is formed of a ceramic laminate S and has a rectangular shape in plan view, and which has a front surface 3 and a back surface 4 and has four side surfaces 5, each being located between the front surface 3 and the back surface 4, and having a groove surface 7 located on a side toward the front surface 3 and a fracture surface 6 located on a side toward the back surface 4; and a metalized layer 11 which is formed on the front surface 3 of the substrate main body 2 so as to extend along the four side surfaces 5, and which has a rectangular frame shape in plan view, wherein a horizontal surface 13 of the ceramic laminate S of the substrate main body 2 is exposed between the metalized layer 11 and the groove surface 7 of each side surface 5 of the substrate main body 2.
IPC 8 full level
H05K 1/02 (2006.01); H01L 23/12 (2006.01); H05K 3/00 (2006.01)
CPC (source: EP KR US)
C04B 41/0036 (2013.01 - US); H01L 23/10 (2013.01 - EP US); H01L 23/12 (2013.01 - KR); H01L 23/13 (2013.01 - EP US); H01L 23/49805 (2013.01 - EP US); H05K 1/02 (2013.01 - KR); H05K 1/0306 (2013.01 - EP US); H05K 1/14 (2013.01 - US); H05K 3/00 (2013.01 - KR); H05K 3/0052 (2013.01 - EP US); H05K 3/403 (2013.01 - EP US); H01L 23/15 (2013.01 - EP US); H01L 2224/97 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H05K 3/0029 (2013.01 - EP US); H05K 3/0097 (2013.01 - EP US); H05K 2201/017 (2013.01 - US); H05K 2201/09036 (2013.01 - EP US); H05K 2201/09045 (2013.01 - US); H05K 2201/0909 (2013.01 - EP US); H05K 2201/09154 (2013.01 - EP US)
C-Set (source: US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2704537 A1 20140305; EP 2704537 A4 20141008; EP 2704537 B1 20190710; CN 103444270 A 20131211; CN 103444270 B 20160330; JP 2012230945 A 20121122; JP 6006474 B2 20161012; KR 101505355 B1 20150323; KR 20140004223 A 20140110; TW 201251540 A 20121216; TW I488551 B 20150611; US 2015107879 A1 20150423; US 9295151 B2 20160322; WO 2012147243 A1 20121101
DOCDB simple family (application)
EP 12777596 A 20120201; CN 201280014410 A 20120201; JP 2011096829 A 20110425; JP 2012000671 W 20120201; KR 20137030740 A 20120201; TW 101113884 A 20120419; US 201214000568 A 20120201