EP 2705550 A1 20140312 - COMPOUNDS FOR ELECTRONIC DEVICES
Title (en)
COMPOUNDS FOR ELECTRONIC DEVICES
Title (de)
VERBINDUNGEN FÜR ELEKTRONISCHE VORRICHTUNGEN
Title (fr)
COMPOSÉS POUR DISPOSITIFS ÉLECTRONIQUES
Publication
Application
Priority
- EP 11003705 A 20110505
- EP 2012001600 W 20120412
- EP 12714970 A 20120412
Abstract (en)
[origin: WO2012149999A1] The present application relates to a compound with a formula (I), the use of this compound in an electronic device, and an electronic device containing one or more compounds of the formula (I). Furthermore, the invention relates to the manufacture of the compound with the formula (I) and to a formulation containing one or more compounds with the formula (I).
IPC 8 full level
H10K 99/00 (2023.01); C09B 19/00 (2006.01); C09B 21/00 (2006.01); C09B 57/00 (2006.01)
CPC (source: CN EP KR US)
C07D 241/46 (2013.01 - CN); C07D 265/38 (2013.01 - CN); C07D 279/34 (2013.01 - CN); C07D 401/10 (2013.01 - CN); C07D 401/14 (2013.01 - CN); C07D 413/10 (2013.01 - CN); C07D 417/10 (2013.01 - CN); C07F 7/0816 (2013.01 - CN); C07F 9/6547 (2013.01 - CN); C09B 17/02 (2013.01 - EP US); C09B 19/00 (2013.01 - EP US); C09B 21/00 (2013.01 - EP US); C09B 57/00 (2013.01 - EP US); C09B 57/10 (2013.01 - EP US); C09K 11/06 (2013.01 - CN KR); H10K 85/111 (2023.02 - US); H10K 85/113 (2023.02 - US); H10K 85/40 (2023.02 - CN US); H10K 85/654 (2023.02 - CN EP US); H10K 85/657 (2023.02 - CN US); H10K 85/6572 (2023.02 - CN US); H10K 99/00 (2023.02 - KR); C09K 2211/1029 (2013.01 - CN); C09K 2211/1033 (2013.01 - CN); C09K 2211/1037 (2013.01 - CN); C09K 2211/104 (2013.01 - CN); C09K 2211/1044 (2013.01 - CN); C09K 2211/1059 (2013.01 - CN); H10K 50/11 (2023.02 - EP US); H10K 50/16 (2023.02 - EP US); H10K 85/324 (2023.02 - EP US); H10K 85/342 (2023.02 - EP US); H10K 2101/10 (2023.02 - EP US); Y02E 10/549 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2012149999 A1 20121108; CN 103503188 A 20140108; CN 103503188 B 20160831; EP 2705550 A1 20140312; EP 2705550 B1 20170705; JP 2014527022 A 20141009; JP 6195823 B2 20170913; KR 102014552 B1 20191021; KR 20140045368 A 20140416; US 10177312 B2 20190108; US 2014070146 A1 20140313
DOCDB simple family (application)
EP 2012001600 W 20120412; CN 201280021987 A 20120412; EP 12714970 A 20120412; JP 2014508701 A 20120412; KR 20137032153 A 20120412; US 201214115107 A 20120412