EP 2705930 A3 20140813 - Carrier apparatus of thin disk-shaped workpiece, method of manufacturing the same, and both-side grinding machine
Title (en)
Carrier apparatus of thin disk-shaped workpiece, method of manufacturing the same, and both-side grinding machine
Title (de)
Trägervorrichtung von dünnen scheibenförmigen Werkstücken, Herstellungsverfahren dafür, und Doppelseitenschleifmaschine
Title (fr)
Appareil de support de pièce en forme de disque fin, procédé de fabrication associé et meuleuse bilatérale
Publication
Application
Priority
JP 2012195611 A 20120905
Abstract (en)
[origin: EP2705930A2] A carrier apparatus (6) simple and inexpensive in structure, and capable of assuring machining at high efficiency and high precision, in machining of a surface of a thin disk-shaped workpiece (W). In an apparatus for grinding the surface of a workpiece (W) while supporting and rotating a thin disk-shaped workpiece (W), the carrier apparatus (6) constitutes a workpiece rotation supporting device (5) for rotating and driving while positioning and supporting the circular outer circumference of the workpiece (W), and comprises an annular carrier main body (31) having a circular inner peripheral edge (31a) surrounding closely the whole circumference of the workpiece (W), and a notch trigger (32) having a pointed end engaging part (32b) to be engaged with a notch (Wn) in the workpiece (W), being formed as an integral piece, in which the notch trigger (32) is a separate part from the carrier main body (31), so as to be exchangeable and joined and fixed integrally, and the pointed end engaging part (32b) has a mounting structure of projecting inward in a radial direction from a part of the circular inner peripheral edge (31a) of the carrier main body (31).
IPC 8 full level
B24B 37/08 (2012.01); B24B 37/28 (2012.01)
CPC (source: EP KR)
B24B 37/08 (2013.01 - EP KR); B24B 37/28 (2013.01 - EP); B24B 37/32 (2013.01 - KR)
Citation (search report)
- [XDY] JP 2003071704 A 20030312 - NIPPEI TOYAMA CORP
- [Y] JP 2000288921 A 20001017 - HOYA CORP
- [Y] JP 2009178780 A 20090813 - SEIKO INSTR INC
- [Y] JP 2003124167 A 20030425 - SUMITOMO HEAVY INDUSTRIES
- [AD] JP H11333707 A 19991207 - TOSHIBA CERAMICS CO
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2705930 A2 20140312; EP 2705930 A3 20140813; EP 2705930 B1 20220216; JP 2014050901 A 20140320; JP 6033614 B2 20161130; KR 102093680 B1 20200326; KR 20140031816 A 20140313; SG 2013065842 A 20140428; TW 201417951 A 20140516; TW I632987 B 20180821
DOCDB simple family (application)
EP 13181047 A 20130820; JP 2012195611 A 20120905; KR 20130106217 A 20130904; SG 2013065842 A 20130902; TW 102130043 A 20130822