Global Patent Index - EP 2709212 B1

EP 2709212 B1 20191204 - Assembly for interconnecting circuit boards

Title (en)

Assembly for interconnecting circuit boards

Title (de)

Anordnung zum Verbinden von Leiterplatten

Title (fr)

Agencement destiné à relier des plaquettes

Publication

EP 2709212 B1 20191204 (DE)

Application

EP 12184174 A 20120913

Priority

EP 12184174 A 20120913

Abstract (en)

[origin: EP2709212A1] The arrangement has a printed circuit board (1) comprising a receptacle (3), and another printed circuit board (2) comprising a contact blade that is inserted into the receptacle. The latter circuit board has a lug (4) formed from printed circuit board material of the latter circuit board, where the lug is inserted into the receptacle for establishing electrical contact between the lug and the receptacle in a form-fit manner. The receptacle has a retaining area for the lug, where the retaining area is formed by a base plate with side walls.

IPC 8 full level

H01R 12/72 (2011.01); H01R 12/71 (2011.01)

CPC (source: EP)

H01R 12/718 (2013.01); H01R 12/721 (2013.01)

Citation (examination)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 2709212 A1 20140319; EP 2709212 B1 20191204

DOCDB simple family (application)

EP 12184174 A 20120913