EP 2709212 B1 20191204 - Assembly for interconnecting circuit boards
Title (en)
Assembly for interconnecting circuit boards
Title (de)
Anordnung zum Verbinden von Leiterplatten
Title (fr)
Agencement destiné à relier des plaquettes
Publication
Application
Priority
EP 12184174 A 20120913
Abstract (en)
[origin: EP2709212A1] The arrangement has a printed circuit board (1) comprising a receptacle (3), and another printed circuit board (2) comprising a contact blade that is inserted into the receptacle. The latter circuit board has a lug (4) formed from printed circuit board material of the latter circuit board, where the lug is inserted into the receptacle for establishing electrical contact between the lug and the receptacle in a form-fit manner. The receptacle has a retaining area for the lug, where the retaining area is formed by a base plate with side walls.
IPC 8 full level
H01R 12/71 (2011.01); H01R 12/72 (2011.01)
CPC (source: EP)
H01R 12/718 (2013.01); H01R 12/721 (2013.01)
Citation (examination)
- US 2012264326 A1 20121018 - KUDO TAKAAKI [JP], et al
- US 2980878 A 19610418 - SWENGEL ROBERT C
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DOCDB simple family (application)
EP 12184174 A 20120913