EP 2715742 B1 20190724 - SEMI-FINISHED PRODUCT IN THE FORM OF A CONDUCTIVE STRIP THAT CAN BE EMBEDDED IN A COMPOSITE MATERIAL, AND METHOD FOR MANUFACTURING SUCH A STRIP
Title (en)
SEMI-FINISHED PRODUCT IN THE FORM OF A CONDUCTIVE STRIP THAT CAN BE EMBEDDED IN A COMPOSITE MATERIAL, AND METHOD FOR MANUFACTURING SUCH A STRIP
Title (de)
HALBERZEUGNIS IN FORM EINES LEITENDEN STREIFENS ZUR EINBETTUNG IN EINEM VERBUNDWERKSTOFF UND VERFAHREN ZUR HERSTELLUNG EINES SOLCHEN STREIFENS
Title (fr)
SEMI-PRODUIT SOUS LA FORME D'UNE BANDE CONDUCTRICE INTÉGRABLE DANS UN MATÉRIAU COMPOSITE ET PROCÉDE DE FABRICATION D'UNE TELLE BANDE
Publication
Application
Priority
- FR 1154667 A 20110527
- EP 2012059056 W 20120515
Abstract (en)
[origin: WO2012163674A1] The invention relates to a semi-finished product in the form of a strip (101, 102) that can be deposited by drape-forming so as to constitute a laminated composite material, characterized in that it includes, along a cross-section thereof and along the entire length thereof: a first conductive layer (105, 106) made of an electrically conductive material; two isolating layers (121, 122) made of a dielectric material completely surrounding the conductive layer (105, 106), the widths of the cross-sections of which is greater than the width of the conductive layer; two bonding layers (111, 112) extending in the thickness direction on either side of the isolation layers (121, 122) and outside the strip (101, 102). The invention also relates to a method for the continuous production of such a strip.
IPC 8 full level
H01B 7/08 (2006.01); H01B 7/02 (2006.01); H01B 13/06 (2006.01); H01B 13/10 (2006.01)
CPC (source: EP US)
H01B 7/02 (2013.01 - US); H01B 7/0838 (2013.01 - EP US); H01B 13/06 (2013.01 - US); H01B 13/103 (2013.01 - EP US); Y10T 29/49117 (2015.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
FR 2975864 A1 20121130; EP 2715742 A1 20140409; EP 2715742 B1 20190724; US 2014290977 A1 20141002; WO 2012163674 A1 20121206
DOCDB simple family (application)
FR 1154667 A 20110527; EP 12722133 A 20120515; EP 2012059056 W 20120515; US 201214117054 A 20120515