Global Patent Index - EP 2715824 A1

EP 2715824 A1 20140409 - OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT

Title (en)

OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT

Title (de)

OPTOELEKTRONISCHES BAUELEMENT UND VERFAHREN ZUM HERSTELLEN EINES OPTOELEKTRONISCHEN BAUELEMENTS

Title (fr)

COMPOSANT OPTOÉLECTRONIQUE ET PROCÉDÉ DE FABRICATION D'UN COMPOSANT OPTOÉLECTRONIQUE

Publication

EP 2715824 A1 20140409 (DE)

Application

EP 12714270 A 20120329

Priority

  • DE 102011076750 A 20110531
  • EP 2012055602 W 20120329

Abstract (en)

[origin: WO2012163569A1] In various exemplary embodiments, an optoelectronic component (500) is provided. The optoelectronic component (500) can comprise at least one layer (100, 200, 300) of the optoelectronic component (500); at least one adhesive (504) on the layer (100, 200, 300) of the optoelectronic component (500); and a cover (506) on the at least one adhesive (504); wherein the at least one adhesive (504) is cured only in a partial region (508) above a substrate (502) and/or above the layer (100, 200, 300).

IPC 8 full level

H10K 99/00 (2023.01)

CPC (source: CN EP KR US)

H10K 10/88 (2023.02 - CN EP US); H10K 30/88 (2023.02 - CN EP US); H10K 50/8426 (2023.02 - CN EP KR US); H10K 50/844 (2023.02 - CN EP KR US); H10K 50/858 (2023.02 - CN EP KR US); H10K 71/00 (2023.02 - US); H10K 71/00 (2023.02 - CN EP KR); H10K 71/16 (2023.02 - CN EP KR); H10K 2102/331 (2023.02 - CN EP US); Y02E 10/549 (2013.01 - EP US); Y02P 70/50 (2015.11 - EP US)

Citation (examination)

US 2011121350 A1 20110526 - LEE KYUNG-JUN [KR], et al

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

DE 102011076750 A1 20121206; CN 103563116 A 20140205; EP 2715824 A1 20140409; KR 20140021052 A 20140219; KR 20150055627 A 20150521; US 2014077201 A1 20140320; US 9190628 B2 20151117; WO 2012163569 A1 20121206

DOCDB simple family (application)

DE 102011076750 A 20110531; CN 201280026783 A 20120329; EP 12714270 A 20120329; EP 2012055602 W 20120329; KR 20137035048 A 20120329; KR 20157011536 A 20120329; US 201214117888 A 20120329