EP 2718875 A1 20140416 - A METHOD FOR MANUFACTURING A CARD CONNECTOR
Title (en)
A METHOD FOR MANUFACTURING A CARD CONNECTOR
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES KARTENVERBINDERS
Title (fr)
PROCÉDÉ DE FABRICATION D'UN CONNECTEUR DE CARTE
Publication
Application
Priority
IB 2011001675 W 20110608
Abstract (en)
[origin: WO2012168752A1] The invention relates to a method for manufacturing a card connector or a card comprising the step of depositing layers (31,32,33,34,35) of connector materials onto a substrate (10) so as to form a pattern of contacts (30) for a connector. It also comprises the step of removing the substrate (10) from the pattern of contacts (30) so as to expose the contacts (30). The substrate to be removed (10) is made of conductive material. The method comprises the step of depositing at least one layer (31,32,33,34,35) of the pattern of contacts (30) by electro-deposition by making use of the substrate to be removed (10) as a conductor for electric current used in the electro-deposition. The invention may also comprise the step of overmolding the card body compound, after having mounted and connected a chip to the connector, and before peeling off the substrate.
IPC 8 full level
G06K 19/077 (2006.01); H01L 21/56 (2006.01)
CPC (source: EP)
G06K 19/07743 (2013.01); H01L 21/568 (2013.01); H01L 23/3121 (2013.01); H01L 24/97 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18301 (2013.01)
C-Set (source: EP)
Citation (search report)
See references of WO 2012168752A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DOCDB simple family (application)
IB 2011001675 W 20110608; EP 11767755 A 20110608