EP 2718876 A1 20140416 - PREPARING A SUBSTRATE FOR EMBEDDING WIRE
Title (en)
PREPARING A SUBSTRATE FOR EMBEDDING WIRE
Title (de)
HERSTELLUNG EINES SUBSTRATS ZUM EINBETTEN EINES DRAHTES
Title (fr)
PRÉPARATION D'UN SUBSTRAT EN VUE D'Y INTÉGRER UN FIL
Publication
Application
Priority
- US 201161493448 P 20110604
- US 201161493611 P 20110606
- US 201113205600 A 20110808
- US 201113224351 A 20110902
- US 201113294578 A 20111111
- US 201213430739 A 20120327
- EP 2012059946 W 20120529
Abstract (en)
[origin: WO2012168106A1] The surface of a substrate (302; FIGs. 3C,3D,3E,3F,3G,3H; 4G)may be prepared for mounting an antenna wire (310)such as by removing material to form a sequence of ditches (holes) separated by bridges (lands), and conforming to a pattern (110) for the antenna, which is typically a flat squared spiral, having a number of turns. The antenna wire may be laid in the ditches and embedded in the bridges. Additional features, such as undermining (FIG. 3H) or removing material from adjacent (FIG. 4G, 4H) the bridges may facilitate displacement of substrate material at the bridges. The collapsed bridges form pinch points (FIG. 3E), securing the wire in the substrate. In some embodiments of the invention, relevant portions of the substrate are prepared for embedding antenna wire, without removing material. The substrate may be an inlay substrate or card body for a secure document.
IPC 8 full level
G06K 19/077 (2006.01)
CPC (source: EP)
G06K 19/07749 (2013.01); G06K 19/07773 (2013.01); G06K 19/07783 (2013.01)
Citation (search report)
See references of WO 2012168106A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
DOCDB simple family (application)
EP 2012059946 W 20120529; EP 12728426 A 20120529