EP 2720266 B1 20211020 - Luminescence device
Title (en)
Luminescence device
Title (de)
Lumineszenz-Vorrichtung
Title (fr)
Dispositif de luminescence
Publication
Application
Priority
KR 20120111596 A 20121009
Abstract (en)
[origin: EP2720266A2] A luminescence device used in a backlight unit for lighting or displaying may be provided that includes: a substrate (11) including at least two electrode patterns (12, 13); LED chips (14) which are disposed on the substrate and include a phosphor (S) disposed thereon; and a dam (18) disposed on the substrate, wherein the dam is disposed spaced from the LED Chips, and wherein the substrate comprises a direct copper bonding (DCB) substrate including a first copper layer (2), a second copper layer (3) and a substrate body (1).
IPC 8 full level
H01L 25/075 (2006.01); H01L 33/64 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01)
CPC (source: CN EP KR US)
H01L 25/0753 (2013.01 - CN EP US); H01L 27/15 (2013.01 - US); H01L 33/48 (2013.01 - KR); H01L 33/56 (2013.01 - US); H01L 33/62 (2013.01 - KR); H01L 33/641 (2013.01 - CN EP US); H01L 33/58 (2013.01 - EP US); H01L 33/62 (2013.01 - CN EP US); H01L 2224/48091 (2013.01 - CN EP US)
Citation (examination)
- US 2007223219 A1 20070927 - MEDENDORP NICHOLAS W JR [US], et al
- US 2002105002 A1 20020808 - ONO KOJI [JP]
- CN 102222757 A 20111019 - SAMSUNG LED CO LTD
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2720266 A2 20140416; EP 2720266 A3 20160316; EP 2720266 B1 20211020; CN 103715338 A 20140409; JP 2014078695 A 20140501; KR 20140047750 A 20140423; US 2014097452 A1 20140410; US 9093626 B2 20150728
DOCDB simple family (application)
EP 13184243 A 20130913; CN 201310467515 A 20131009; JP 2013183879 A 20130905; KR 20120111596 A 20121009; US 201314010592 A 20130827