EP 2720368 B1 20170208 - POWER MODULE AND POWER CONVERSION APPARATUS USING SAME
Title (en)
POWER MODULE AND POWER CONVERSION APPARATUS USING SAME
Title (de)
STROMMODUL UND STROMUMRICHTERVORRICHTUNG DAMIT
Title (fr)
MODULE DE PUISSANCE ET APPAREIL DE CONVERSION DE PUISSANCE UTILISANT LEDIT MODULE
Publication
Application
Priority
- JP 2011128304 A 20110608
- JP 2012063065 W 20120522
Abstract (en)
[origin: EP2720368A1] A power module includes a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit, a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices and a module case configured to accommodate the semiconductor devices and the conductive plates, wherein the module case includes a heat radiation member made of plate-like metal and facing a surface of the conductive plate and a metallic frame body having an opening portion that is closed by the heat radiation member, and wherein a heat radiation fin unit having a plurality of heat radiation fins vertically arranged thereon is provided at a center of the heat radiation member, and a joint portion with the frame body is provided at an external peripheral edge of the heat radiation member, and the heat radiation member has a heat conductivity higher than that of the frame body, and the frame body is of a higher rigidity than that of the heat radiation member.
IPC 8 full level
H01L 23/373 (2006.01); B60L 50/16 (2019.01); H01L 23/473 (2006.01); H02M 7/00 (2006.01)
CPC (source: EP US)
B60L 50/16 (2019.01 - EP US); H01L 23/36 (2013.01 - EP US); H01L 23/3736 (2013.01 - EP US); H01L 23/473 (2013.01 - EP US); H01L 24/36 (2013.01 - US); H01L 24/40 (2013.01 - EP US); H02M 7/003 (2013.01 - EP US); H02P 27/06 (2013.01 - US); H02P 29/60 (2016.02 - EP US); H05K 7/209 (2013.01 - US); H05K 7/20909 (2013.01 - US); H05K 7/20927 (2013.01 - EP US); B60L 2200/26 (2013.01 - EP US); B60L 2210/40 (2013.01 - EP US); H01L 25/072 (2013.01 - EP); H01L 25/18 (2013.01 - EP); H01L 2224/0603 (2013.01 - EP); H01L 2224/33 (2013.01 - EP US); H01L 2224/40137 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/72 (2013.01 - EP); H01L 2224/73265 (2013.01 - EP US); H01L 2224/83801 (2013.01 - EP US); H01L 2224/8384 (2013.01 - EP US); H01L 2224/84801 (2013.01 - EP US); H01L 2224/8484 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP); H01L 2924/13055 (2013.01 - EP US); H01L 2924/13091 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); Y02T 10/70 (2013.01 - US); Y02T 10/7072 (2013.01 - EP US); Y02T 10/72 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2720368 A1 20140416; EP 2720368 A4 20151118; EP 2720368 B1 20170208; CN 103597729 A 20140219; CN 103597729 B 20160316; JP 2012257369 A 20121227; JP 5502805 B2 20140528; US 2014098588 A1 20140410; US 2016095264 A1 20160331; US 9241429 B2 20160119; WO 2012169342 A1 20121213
DOCDB simple family (application)
EP 12797538 A 20120522; CN 201280028057 A 20120522; JP 2011128304 A 20110608; JP 2012063065 W 20120522; US 201214124172 A 20120522; US 201514962316 A 20151208