Global Patent Index - EP 2721114 A1

EP 2721114 A1 20140423 - SILVER-CONTAINING AQUEOUS INK FORMULATION FOR PRODUCING ELECTRICALLY CONDUCTIVE STRUCTURES, AND INK JET PRINTING METHOD FOR PRODUCING SUCH ELECTRICALLY CONDUCTIVE STRUCTURES

Title (en)

SILVER-CONTAINING AQUEOUS INK FORMULATION FOR PRODUCING ELECTRICALLY CONDUCTIVE STRUCTURES, AND INK JET PRINTING METHOD FOR PRODUCING SUCH ELECTRICALLY CONDUCTIVE STRUCTURES

Title (de)

SILBERHALTIGE WÄSSRIGE TINTEN-FORMULIERUNG ZUR HERSTELLUNG VON ELEKTRISCH LEITFÄHIGEN STRUKTUREN UND TINTENSTRAHLDRUCKVERFAHREN ZUR HERSTELLUNG SOLCHER ELEKTRISCH LEITFÄHIGEN STRUKTUREN

Title (fr)

FORMULATION D'ENCRE AQUEUSE CONTENANT DE L'ARGENT POUR LA PRODUCTION DE STRUCTURES ÉLECTRO-CONDUCTRICES ET PROCÉDÉ D'IMPRESSION À JET D'ENCRE POUR LA PRODUCTION DE TELLES STRUCTURES ÉLECTRO-CONDUCTRICES

Publication

EP 2721114 A1 20140423 (DE)

Application

EP 12729929 A 20120613

Priority

  • DE 102011077492 A 20110614
  • EP 2012061157 W 20120613

Abstract (en)

[origin: WO2012171936A1] The invention relates to a silver-containing aqueous ink formulation for producing electrically conductive structures, wherein the formulation is provided as a two-component system made of a carrier component A, at least containing an organic solvent, additives and water, and a silver nanoparticle as component B, at least containing a liquid dispersion agent, stabilized silver nanoparticle and an electrostatic dispersion stabilizer. The formulation comprises of components A and B containing at least a) 1 - 50 wt% organic solvent, b) 0.005 - 12 wt% additives, c) 40-70 wt% water, and d) 15-50 wt% electrostatically stabilized silver nanoparticles, wherein the sum of all portions of the ink formulation make up 100%. The invention furthermore relates to a method for producing such ink formulations, to a method for producing electrically conductive structures and/or coatings on a substrate, and to the use of an ink formulation according to the invention as ink for ink jet printers and/or for creating electrically conductive structures and coatings.

IPC 8 full level

C09D 11/00 (2014.01); H01B 1/24 (2006.01); H05K 1/09 (2006.01)

CPC (source: EP US)

C08K 3/28 (2013.01 - US); C08K 3/38 (2013.01 - US); C09D 11/322 (2013.01 - EP US); C09D 11/36 (2013.01 - US); C09D 11/52 (2013.01 - EP US); C09D 139/06 (2013.01 - US); H01B 1/22 (2013.01 - EP US); H01B 13/0016 (2013.01 - US); H01B 13/0026 (2013.01 - US); H05K 1/097 (2013.01 - EP US); H05K 2203/1131 (2013.01 - EP US); Y10T 428/24909 (2015.01 - EP US)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2012171936 A1 20121220; CA 2838546 A1 20121220; CN 103732701 A 20140416; EP 2721114 A1 20140423; JP 2014523459 A 20140911; KR 20140040805 A 20140403; US 2015037550 A1 20150205

DOCDB simple family (application)

EP 2012061157 W 20120613; CA 2838546 A 20120613; CN 201280034813 A 20120613; EP 12729929 A 20120613; JP 2014515167 A 20120613; KR 20147000919 A 20120613; US 201214125756 A 20120613