Global Patent Index - EP 2731203 B1

EP 2731203 B1 20180509 - Method for moisture-proof covering of a junction between an electric conductor and a contact element

Title (en)

Method for moisture-proof covering of a junction between an electric conductor and a contact element

Title (de)

Verfahren zum feuchtigkeitsdichten Abdecken einer Verbindungsstelle zwischen einem elektrischen Leiter und einem Kontaktelement

Title (fr)

Procédé de recouvrement imperméable d'un emplacement de liaison entre un conducteur électrique et un élément de contact

Publication

EP 2731203 B1 20180509 (DE)

Application

EP 12306030 A 20120829

Priority

EP 12306030 A 20120829

Abstract (en)

[origin: US2014059853A1] A method is disclosed for moisture tight covering a connection point between an electrical conductor. The method includes exposing the conductor at its end by removing the insulation and subsequently electrically conductively connecting the end of the conductor, from which the insulation has been removed, to the contact element. After the connection point is finished, a foil of insulation material is positioned underneath the connection point, where the foil rests against the insulation of the conductor and at least partially against the contact element. Subsequently, a sealing material capable of hardening is applied from above onto the conductor, wherein the sealing material is flowable during its application and subsequently changes over by hardening into a mechanically stable state which extends beyond the insulation of the conductor and beyond the contact element and is connected tightly to the foil.

IPC 8 full level

H01R 13/52 (2006.01)

CPC (source: EP US)

H01R 4/70 (2013.01 - EP US); H01R 43/005 (2013.01 - EP US); H01R 4/023 (2013.01 - EP US); Y10T 29/49171 (2015.01 - EP US)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

US 10594103 B2 20200317; US 2014059853 A1 20140306; EP 2731203 A1 20140514; EP 2731203 B1 20180509; ES 2683007 T3 20180924

DOCDB simple family (application)

US 201313975417 A 20130826; EP 12306030 A 20120829; ES 12306030 T 20120829