EP 2733553 A1 20140521 - Systems and methods for external frit mounted components
Title (en)
Systems and methods for external frit mounted components
Title (de)
Systeme und Verfahren für externe frittenmontierte Komponenten
Title (fr)
Systèmes et procédés pour composants montés par frittage externe
Publication
Application
Priority
EP 12193298 A 20121119
Abstract (en)
Embodiments of the present invention provide improved systems and methods for external frit mounted components on a sensor device. In one embodiment, a method for fabricating a sensor device comprises securing at least one component stack on a sensor body over at least one opening in the sensor body, wherein the at least one component stack comprises a plurality of components and applying a frit to the plurality of components in the at least one component stack and the sensor body. The method further comprises heating the frit, the at least one component stack, and the sensor body such that the frit melts and cooling the frit, the at least one component stack, and the sensor body such that the at least one component stack is secured to the sensor body.
IPC 8 full level
G04F 5/14 (2006.01); G01R 33/26 (2006.01); G21K 1/00 (2006.01)
CPC (source: EP)
G04F 5/14 (2013.01)
Citation (search report)
- [XI] US 6837075 B1 20050104 - SNOWDON KENNETH [GB], et al
- [A] EP 2154585 A2 20100217 - HONEYWELL INT INC [US]
- [A] DE 3830149 A1 19900315 - SIEMENS AG [DE]
- [A] JP S61144613 A 19860702 - FUJITSU LTD
- [A] WO 2009025893 A2 20090226 - UNIV COLORADO REGENTS [US], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DOCDB simple family (application)
EP 12193298 A 20121119