EP 2737107 B1 20150909 - ELECTROLESS NICKEL PLATING BATH COMPOSITION
Title (en)
ELECTROLESS NICKEL PLATING BATH COMPOSITION
Title (de)
STROMLOSE VERNICKELUNGSBADZUSAMMENSETZUNG
Title (fr)
COMPOSITION DE BAIN DE NICKELAGE AUTOCATALYTIQUE
Publication
Application
Priority
- EP 11175295 A 20110726
- EP 2012062967 W 20120704
- EP 12743909 A 20120704
Abstract (en)
[origin: EP2551375A1] The present invention relates to an aqueous plating bath composition for depositing a nickel phosphorous alloy having a phosphorous content in the range of 5 to 12 wt.-%. The plating bath comprises a sulfur-containing organic stabilising agent.
IPC 8 full level
C23C 18/36 (2006.01)
CPC (source: EP US)
C23C 18/36 (2013.01 - EP US)
Citation (opposition)
Opponent : COVENTYA GmbH
- WO 2010069810 A1 20100624 - BASF SE [DE], et al
- EP 1489201 A2 20041222 - RASCHIG GMBH [DE]
- CH 620710 A5 19801215 - POTAPOV FEDOR PETROVICH, et al
- GB 2155041 A 19850918 - OMI INT CORP
- US 2006264043 A1 20061123 - STEWART MICHAEL P [US], et al
- EP 2551375 A1 20130130 - ATOTECH DEUTSCHLAND GMBH [DE]
- MALLORY ET AL.: "Electroless Plating: Fundamentals and Applications", AMERICAN ELECTROPLATERS AND SURFACE FINISHERS SOCIETY, 1990, pages 1 - 3, XP055290733
- LIU ET AL.: "Effect of organic additives on the corrosion resistance properties of electroless nickel deposits", THIN SOLID FILMS, 11 October 2007 (2007-10-11), pages 1883 - 1889, XP022449729
Opponent : Coventya GmbH
- WO 2010069810 A1 20100624 - BASF SE [DE], et al
- EP 1489201 A2 20041222 - RASCHIG GMBH [DE]
- CH 620710 A5 19801215 - POTAPOV FEDOR PETROVICH, et al
- GB 2155041 A 19850918 - OMI INT CORP
- US 2006264043 A1 20061123 - STEWART MICHAEL P [US], et al
- EP 2551375 A1 20130130 - ATOTECH DEUTSCHLAND GMBH [DE]
- GLENN O. MALLO RY ET AL.: "Electroless Plating: Fundamentals and Applications", ELECTROLESS PLATING: FUNDAMENTALS AND APPLICATIONS, 1990, XP055290733
- H.-P. LIU ET AL.: "Effect of organic additives on the corrosion resistance properties of electroless nickel deposits", THIN SOLID FILMS, vol. 516, 2008, pages 1883 - 1889, XP022449729
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2551375 A1 20130130; CN 103946420 A 20140723; CN 103946420 B 20151125; EP 2737107 A1 20140604; EP 2737107 B1 20150909; JP 2014521834 A 20140828; JP 6053785 B2 20161227; KR 101936977 B1 20190109; KR 20140041762 A 20140404; TW 201309844 A 20130301; TW I555878 B 20161101; US 2014150689 A1 20140605; WO 2013013941 A1 20130131
DOCDB simple family (application)
EP 11175295 A 20110726; CN 201280036718 A 20120704; EP 12743909 A 20120704; EP 2012062967 W 20120704; JP 2014522015 A 20120704; KR 20147001368 A 20120704; TW 101127003 A 20120726; US 201214131949 A 20120704